UNDERFILL FOR GOOD ADHESION AND LOW VISCOSITY Search Results

UNDERFILL FOR GOOD ADHESION AND LOW VISCOSITY Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
TCR5RG28A		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F
TCR3DM18		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 1.8 V, 300 mA, DFN4
TCR3DG18		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 1.8 V, 300 mA, WCSP4E
TCR2EF18		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV)
TCR3RM28A		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 2.8 V, 300 mA, DFN4C

UNDERFILL FOR GOOD ADHESION AND LOW VISCOSITY Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
KJR9022E Abstract: KJR4013E GTO thyristor driver KJR651 KJR9061E silicone low volatile potting G1821 KJR-9010E KJR651E KJR9060E Text: Shin-Etsu Liquid Coating Materials for Electronic Devices KJR Series Junction Coating Resins Liquid Type Silicone & Polyimide Silicone for Electronic, Electric and Optical Devices Main Features ●Ultra High Purity ●High Thermal Stability ●High Electrical Stability	Original	PDF
NATIONAL SEMICONDUCTOR ink MARKING Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as	Original	PDF
cte table flip chip substrate Abstract: underfill Vickers corrosion inhibitor Low viscosity underfill epoxy Text: A Novel Flip Chip Bonding Technology using Au Stud Bump and Lead-free Solder Yoshihiro Yoneda1 , Toshiyuki Kuramochi1 , Tsuyoshi Sohara1 and Jae-Min Liao2 1 Fujitsu Media Devices, Ltd. Kawasaki, Japan 2 Fujitsu Microelectronics, Inc. San Jose, California, USA	Original	PDF
underfill Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.	Original	PDF
WLCSP smt Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None	Original	PDF	AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Intel reflow soldering profile BGA Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764 Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems	Original	PDF
LGA 2011 Socket diagram Abstract: senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.1.01 Mar 2011 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please	Original	PDF	propert8175-9600, R50ZZ0003EJ0101 REJ11K0001-0900) LGA 2011 Socket diagram senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray
SMD 8PIN IC MARKING CODE 251 Abstract: No abstract text available Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.2.00 Mar 2012 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please	Original	PDF	R50ZZ0003EJ0200 REJ11K0001-0900) SMD 8PIN IC MARKING CODE 251
ZDX60 Abstract: zdx60 equivalent LME0305D NMA0512D dc-dc converter step up 12v t0 48v Zener Diodes 500mW NMA0512 NME0524 EIA-232 NMA0505S Text: DC-DC CONVERTER APPLICATIONS Contents terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 connecting DC-DC converters in series . . . . . . . . . . . . . . 7 connecting DC-DC converters in parallel . . . . . . . . . . . . . 8	Original	PDF	IEC950 300Vrms 420VAC) EN60950 ZDX60 zdx60 equivalent LME0305D NMA0512D dc-dc converter step up 12v t0 48v Zener Diodes 500mW NMA0512 NME0524 EIA-232 NMA0505S
ZDX60 Abstract: calculating circuit breaker MTBF rx1 1240 calculating rectifier circuits MTBF RO5B12 MIL-HDBK-271F EIA-232 RP30-2405SEW R05B12 R24O05 Text: DC-DC Converter Applications Content ● Terminology 266 ● Limiting Inrush Current 270 Calculation of heatsinks 266 ● Line Impedance Stabilisation Network LISN 277 ● Line Spectra of DC-DC Converters ● Efficiency at FulI Load 266 Input to Output Isolation	Original	PDF	256mm RP03-SMD, RP05-SMD, RP08-SMD REC10, REC15 RP40-G REC20, REC30 REC40-E ZDX60 calculating circuit breaker MTBF rx1 1240 calculating rectifier circuits MTBF RO5B12 MIL-HDBK-271F EIA-232 RP30-2405SEW R05B12 R24O05
newport components 76250 transformer Abstract: lem lc 1000-s ZDX60 LME0305D LEM LC 500-S newport 76250 zener diode 5zs smps based 45 watt inverter 76250 transformer ML-120 transistor Text: CONTENTS CORPORATE OVERVIEW . . . . . . . . . . . . . . . . . . . . . . 1-5 QUALITY OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . 1-7 DESIGN OVERVIEW 1-9 . . . . . . . . . . . . . . . . . . . . . . . . 1-3 1 - CONTENTS General Information Founded in 1982, with a history stretching	Original	PDF
MTBF fit IGBT 1200 Abstract: ZDX60 MTBF recom 9013 SMD RP10-xxxxDE optocoupler MTBF calculation 7805 LDO TRANSISTOR REPLACEMENT GUIDE pnp ZF H SMD RP40-S Text: We’ve got the Power. HIGH POWER WHITE LIGHT CONSTANT CURRENT LED-DRIVERS DROP IN REPLACEMENT FOR 3-PIN REGULATORS 78 SERIES SWITCHING REGULATORS EFFICIENCIES UP TO 97% NEW! 100% POWER. NO DERATING. HIGH EFFICIENCY HIGH TEMP. DC-DC POWER MODULES MICROSIZE PCB MOUNT	Original	PDF	EN55022/FCC MTBF fit IGBT 1200 ZDX60 MTBF recom 9013 SMD RP10-xxxxDE optocoupler MTBF calculation 7805 LDO TRANSISTOR REPLACEMENT GUIDE pnp ZF H SMD RP40-S
MTBF fit IGBT 1200 Abstract: LTC4416 Text: Application Notes SPECIFICATION CHECKLIST Use this checklist to help you define your specification. If you can’t find a converter that fulfils your needs then call us, fax us, e-mail us or use our Web Sample Enquiry link and we will find the best match for you.	Original	PDF	R-78Axx-xxSMD R-78AAxx-xxSMD RSZ-0505 EIA-481-2 MTBF fit IGBT 1200 LTC4416
SPRU811 Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue	Original	PDF	SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate