PCI express PCB footprint
Abstract: datasheet of BGA Staggered pins "differential via" via antipad pitch Geest UM5000
Text: DesignCon 2005 Connector footprint optimization enables 10 Gb+ signal transmission Jan De Geest, PhD Winnie Heyvaert Stefaan Sercu, PhD Dana Bergey FCI Communications, Data, Consumer Division FCI ’s-Hertogenbosch BV Victorialaan 1 5213 JG ’s-Hertogenbosch
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bryan adams
Abstract: fg wilson generator prbs using lfsr hyperlynx dell monitor circuit diagram led based graphic equalizer ic matlab Seminar Microwave PIN diode spice 750um Design Seminar Signal Transmission
Text: DesignCon 2007 Pre-Emphasis and Equalization Parameter Optimization with Fast, WorstCase/Multibillion-Bit Verification Andy Turudic, Altera Corporation aturudic@altera.com Steven McKinney, Mentor Graphics Steven_McKinney@mentor.com Vladimir Dmitriev-Zdorov
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CP-01021-1
bryan adams
fg wilson generator
prbs using lfsr
hyperlynx
dell monitor circuit diagram
led based graphic equalizer ic
matlab Seminar
Microwave PIN diode spice
750um
Design Seminar Signal Transmission
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vita 30.1
Abstract: 2mm wafer cable 973056 ERNI 973031 973011
Text: ERmet ZD www.erni.com Catalog E 074505 01/02 Edition 3 www.erni.com Catalog E 074505 01/02 Edition 3 Contents Introduction Daughter Card Connector 4 Pair Module Daughter Card Connector 3 Pair Module Daughter Card Connector 2 Pair Module Backplane Connector 4 Pair Module
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connector pin contact
Abstract: 973028 2 pin male connector 2mm pitch via antipad pitch 973027 ERNI Electronics 973020 ERNI 973031 ERmet ZD
Text: ERmet ZD www.erni.com www.ERNI.com/contact/ Catalog E 074505 1 04/04 Edition 6 www.erni.com Catalog E 074505 04/04 Edition 6 Contents Introduction Daughter Card Connector 4 Pair Module Daughter Card Connector 3 Pair Module Daughter Card Connector 2 Pair Module
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Abstract: No abstract text available
Text: ERmet ZD Application Note Version 1.1 Technical Features The ERmet ZD is specifically designed for high speed differential signaling in telecom applications at data rates of up to 5 Gbit/s. This robust, high performance, modular connector system is also designed to be used in conjunction with the 2mm
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132-ball
Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
Text: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages
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MEGTRON 6
Abstract: AN-672
Text: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission 2013.02.15 AN-672 Subscribe Feedback As transceiver data rates increase and the unit interval time UI decrease, the end-to-end link design of a transceiver channel becomes increasingly critical to the overall performance of the link. Consider an Altera
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AN-672
100-Gpbs
CEI-25G-LR
CEI-28G-VSR.
CEI-28G-VSR
MEGTRON 6
AN-672
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feature of ic UM 66
Abstract: rx tx
Text: DesignCon 2007 Improving System Performance by Reducing System Impedance to 85 Ohms Jan De Geest, FCI Jan.DeGeest@fciconnect.com Dana Bergey, FCI Dana.Bergey@fciconnect.com John Lynch, Intel John.M.Lynch@intel.com Dennis Miller, Intel Dennis.Miller@intel.com
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UMN64
Abstract: 4000ZE 17x7 LC4256ZE MN64 via antipad pitch BN256
Text: 针 对 采 用 BGA封 装 的 可 编 程 逻 辑 器 件 设 计 的 低成本布板技术 莱迪思半导体白皮书 2010年7月 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1
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h4000ZE
NSEW24
mm144CsBGAispMACH
4000ZE
LC4256ZE-MN144dog-bonefanout
mm132CsBGAMachXO
LCMXO640-M132/MN132
UMN64
4000ZE
17x7
LC4256ZE
MN64
via antipad pitch
BN256
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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AN10778
LPC2220,
LPC2292,
LPC2364,
LPC2368,
LPC2458,
LPC2468,
LPC2470,
LPC2478,
LPC2880,
LPC2468 reflow solder profile
0.65mm pitch BGA
1mm pitch BGA
AN10778
MO-275
TFBGA208
LFBGA32
LPC2468 pcb
SOT1018-1
nxp cross
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IPC-2221A
Abstract: IPC-2152 AN2747 IPC-275 hf Power Supplies MPC8641 MPC8641D DRN2 SC458 IRF7821
Text: Freescale Semiconductor Application Note AN3065 Rev. 0, 06/2007 Power Supply Design Guidelines for the MPC8641 and MPC8641D by Gary Milliorn DSD Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist in creating a
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AN3065
MPC8641
MPC8641D
MPC8641D
IPC-2221A
IPC-2152
AN2747
IPC-275
hf Power Supplies
DRN2
SC458
IRF7821
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IPC-2221A
Abstract: IPC-2152 IPC-275 IPC2221A AN2747 IPC-2221 SMD Capacitor symbols tps5430pwp IPC2221 IPC2152
Text: Freescale Semiconductor Application Note AN3065 Rev. 2, 01/2010 Power Supply Design Guidelines for the MPC8641 and MPC8641D by Networking and Multimedia Group Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist in creating a
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AN3065
MPC8641
MPC8641D
MPC8641D
IPC-2221A
IPC-2152
IPC-275
IPC2221A
AN2747
IPC-2221
SMD Capacitor symbols
tps5430pwp
IPC2221
IPC2152
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IPC-2221A
Abstract: IPC-275 IPC-2152 IPC-2221 AN2747 via antipad pitch MPC8641D tps5430pwp IRF7832 MBR0530
Text: Freescale Semiconductor Application Note AN3065 Rev. 1, 01/2008 Power Supply Design Guidelines for the MPC8641 and MPC8641D by Gary Milliorn DSD Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist in creating a
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AN3065
MPC8641
MPC8641D
MPC8641D
IPC-2221A
IPC-275
IPC-2152
IPC-2221
AN2747
via antipad pitch
tps5430pwp
IRF7832
MBR0530
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2042162-1
Abstract: 2042088-1 50 pin slim connector 1982738-1 via antipad pitch connector pin contact Tyco amp 1.25 catalog
Text: 1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 1 Z-PACK Slim UHD Connector Platform RoHS Ready 1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 2 Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008 www.tycoelectronics.com Introduction Key Features
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Abstract: No abstract text available
Text: ERmet ZD www.erni.com Catalog E 074505 04/07 Edition 7 www.erni.com Catalog E 074505 04/07 Edition 7 ERmet ZD High Speed Differential Hard Metric Connector System Table of Contents ERmet ZD High Speed Differential Hard Metric Connector System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
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23230/USA
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973046
Abstract: 973031 973056 DXSN2285 973028 973019 973080 ERmet ZD E83005 IEC60512
Text: ERmet ZD www.erni.com Catalog E 074505 04/07 Edition 7 www.erni.com Catalog E 074505 04/07 Edition 7 ERmet ZD High Speed Differential Hard Metric Connector System Table of Contents ERmet ZD High Speed Differential Hard Metric Connector System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
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23230/USA
973046
973031
973056
DXSN2285
973028
973019
973080
ERmet ZD
E83005
IEC60512
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IPC-2152
Abstract: sdrx2 IPC-2221A vsc8244hg TP153 11C6 74alvch32973kr RGMII trace mils SMD CAPACITOR L27 tp107
Text: Freescale Semiconductor Application Note Document Number: AN3535 Rev. 0, 2/2008 A Strategy for Routing the MPC8544E in a Six-Layer PCB by Michael George NMG Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist the customer
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AN3535
MPC8544E
MPC8544E
IPC-2152
sdrx2
IPC-2221A
vsc8244hg
TP153
11C6
74alvch32973kr
RGMII trace mils
SMD CAPACITOR L27
tp107
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IPC-2221A
Abstract: 12b3 diode IPC-2152 vsc8244hg TP168 3b6 it manufacture smd 1a5 smd 9A5 TP-114 nc02
Text: Freescale Semiconductor Application Note AN3444 Rev. 0, 10/2007 A Strategy for Routing the MPC8536E in a Six-Layer PCB by Michael George DSD Applications Freescale Semiconductor, Inc. Austin, Texas This application note is a design guide to assist the customer
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AN3444
MPC8536E
MPC8536E
IPC-2221A
12b3 diode
IPC-2152
vsc8244hg
TP168
3b6 it manufacture
smd 1a5
smd 9A5
TP-114
nc02
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SPEAr300
Abstract: SPEAr310 0402 land pattern ddr pcb layout DDR2 pcb layout spear SPEAr320 ARM926 LFBGA289 DL1 327
Text: AN2674 Application note PCB layout guidelines for SPEAr3xx Introduction SPEAr3xx is a 15 x15 mm LFBGA289 device family with 0.8 mm ball pitch. The SPEAr3xx family includes SPEAr300, SPEAr310 and SPEAr320. SPEAr3xx devices all feature the ARM926 core running at up to 333 MHz, an external
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AN2674
LFBGA289
SPEAr300,
SPEAr310
SPEAr320.
ARM926
1420y
SPEAr300
0402 land pattern
ddr pcb layout
DDR2 pcb layout
spear
SPEAr320
DL1 327
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DDR2 pcb layout
Abstract: AA10 AN2797 ARM926 PBGA420
Text: AN2797 Application note PCB layout guidelines for SPEAr600 Introduction SPEAr600 is a 23 x 23 mm PBGA420 device with 1 mm ball pitch. It is a member of the SPEAr family of 32-bit embedded MPUs. The device features dual ARM926 cores running at up to 333 MHz, an external DDR2 memory interface and a full set of powerful on-chip
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AN2797
SPEAr600
SPEAr600
PBGA420
32-bit
ARM926
SPEAr600.
DDR2 pcb layout
AA10
AN2797
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SPEAr300
Abstract: SPEAR320 SPEAr310 AN2674 DDR2 pcb layout ARM926 LFBGA289 0402 land pattern DSASW003738
Text: AN2674 Application note PCB layout guidelines for SPEAr3xx Introduction SPEAr3xx is a 15 x15 mm LFBGA289 device family with 0.8 mm ball pitch. The SPEAr3xx family includes SPEAr300, SPEAr310 and SPEAr320. SPEAr3xx devices all feature the ARM926 core running at up to 333 MHz, an external
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AN2674
LFBGA289
SPEAr300,
SPEAr310
SPEAr320.
ARM926
SPEAr300
SPEAR320
AN2674
DDR2 pcb layout
0402 land pattern
DSASW003738
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Untitled
Abstract: No abstract text available
Text: Titl IDT Tsi577 Serial RapidIO Switch Hardware Manual May 18, 2012 GENERAL DISCLAIMER Integrated Device Technology, Inc. “IDT” reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or
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Tsi577
Tsi577
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tundra srio switch
Abstract: BGA PACKAGE thermal profile chn 037 tsi576
Text: Title Tsi576 Serial RapidIO Switch Hardware Manual Preliminary October 2007 80B804A_MA002_01 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi576, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.
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Tsi576
80B804A
Tsi576,
tundra srio switch
BGA PACKAGE thermal profile
chn 037
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fr4 rlgc
Abstract: No abstract text available
Text: HNAL NCtf" DESIGN TOOLS To m ake high sp eed connectors e as ier to specify a n d use, Sam tec has extended the concept o f m anufacturer supplied P C B p a d layouts a n d connector S P /C E m odels. Sam tec now supplies “reference designs” fo r one o f the
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