100-014-0xx
Abstract: No abstract text available
Text: 3M DIP Socket Screw Machine 100 Series • Accepts various DIP packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Inner contact aligned to maximize contact surface area • Optional seal tape for closed-body configuration
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TS-2115-C
RIA-2217B-D
100-014-0xx
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Untitled
Abstract: No abstract text available
Text: 2.54mm .100" Pitch KK Solid Header FEATURES AND SPECIFICATIONS Features and Benefits • Sizes 2 to 28 circuits ■ Friction lock provides passive lock to connector with ramp ■ 7478 with voids is 7832 Series ■ Various pin lengths available ■ End-to-end stackable
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PS-10-07
E29179
LR19980
Tin--25
Gold--100
C-133
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22-28-8XX2
Abstract: No abstract text available
Text: 2.54mm .100" Pitch KK Breakaway Header FEATURES AND SPECIFICATIONS Features and Benefits Sizes 2 to 36 circuits Available with kinked PC tails .244 or .324" standard mating lengths Tin and 15 or 30µ" Gold plating Voids optional Surface Mount Compatible
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Tin--25
Gold--100
PS-10-07
E29179
LR19980
0066A,
0400A,
22-28-8XX2
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2510 molex connector
Abstract: LR19980 2510 connector molex molex kk 2695
Text: 2.54mm .100" Pitch KK - Header Right Angle Flat, 4094 / 42153 Features and Benefits • · · Sizes 2 to 28 circuits 42153 recommended for circuit sizes greater than 10 4094 with voids is 4494 Series Reference Information · · · · · · Product Specification: PS-10-07
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PS-10-07
E29179
LR19980
Ins22-67-3100
70319-XXXX
2510 molex connector
LR19980
2510 connector molex
molex kk 2695
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Untitled
Abstract: No abstract text available
Text: This document was generated on 08/16/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 45970-4305 Active SEARAY* 1.27mm by 1.27mm Pitch SEARAY* Plug, 400 Circuits, 2.00mm Unmated Height, 10 Rows, Lead-Free, with Voids
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PS-45970-001
PS-45970-002
AS-45970-001
AS-45970-002
AS-45970-990
TS-45970-001
TS-45970-002
AS-45970-001,
AS-45970-002,
AS-45970-990
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Untitled
Abstract: No abstract text available
Text: NOTES: REVISION K 1. REPRESENTS A CRITICAL DIMENSION. 2. SAMTEC LOGO TO APPEAR ON SURFACE AS SHOWN, APPROXIMATELY 4.83[.190] x 17.78[.700], RECESSED 0.25[.010]. 3. MOLDED SURFACES SHALL HAVE MATTE FINISH, SURFACES TO BE FREE OF SCRATCHES, NICKS, SINK AREAS, VOIDS, OR OTHER BLEMISHES.
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Untitled
Abstract: No abstract text available
Text: NOTES: REVISION L 1. REPRESENTS A CRITICAL DIMENSION. 2. SAMTEC LOGO TO APPEAR ON SURFACE AS SHOWN, APPROXIMATELY 4.83[.190] x 17.78[.700], RECESSED 0.25[.010]. 3. MOLDED SURFACES SHALL HAVE MATTE FINISH, SURFACES TO BE FREE OF SCRATCHES, NICKS, SINK AREAS, VOIDS, OR OTHER BLEMISHES.
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B17C
Abstract: 4202 bd datasheet BD 139 N A13B A5l102 A18E 48-7191 A17A 48-2210 AND501
Text: PIN NUMBER 2161-1 102 PIN LENGTH 19.0/.750 PLATING 102 MATING “M” 11.43/.450 PCB “P” 4.37/.172 GOLD “G” N/A TIN “T” OVERALL PACKAGING PK-41661-001 STATUS A-41661-ANA102-* MATERIAL ENGINEERING VOIDS 26-48-1021 26-48-1031 26-48-1041 26-48-1051
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PK-41661-001
-41661-ANA102-*
-A2A102
-A3A102
-A4A102
-A5A102
-A6A102
-A7A102
-A8A102
-A9A102
B17C
4202 bd datasheet
BD 139 N
A13B
A5l102
A18E
48-7191
A17A
48-2210
AND501
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Untitled
Abstract: No abstract text available
Text: PIN NUMBER 2161-21 102 PIN LENGTH 28.58/1.125 PLATING 102 MATING “M” 20.96/.825 PCB “P” 4.37/.172 GOLD “G” N/A TIN “T” OVERALL PACKAGING PK-41661-001 STATUS A-41661-ANF102-* MATERIAL ENGINEERING VOIDS 26-48-4021 26-48-4031 26-48-4041 41661-0113
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PK-41661-001
-41661-ANF102-*
-A2F102
-A3F102
-A4F102
-A5F102
-A6F102
-A7F102
-A8F102
-A9F102
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100 series machine screw SOCKET
Abstract: No abstract text available
Text: 3M PGA Socket Screw Machine 200 Series • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above
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TS-2116-03
100 series machine screw SOCKET
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Untitled
Abstract: No abstract text available
Text: PIN NUMBER 2161-65 501 PIN LENGTH 22.71/.894 PLATING 501 MATING “M” 15.09/.594 PCB “P” 4.37/.172 GOLD “G” OVERALL TIN “T” N/A PACKAGING PK-41661-001 STATUS A-41661-ANAE501-* MATERIAL ENGINEERING VOIDS 26-48-2020 26-48-2030 26-48-2040 26-48-2050
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PK-41661-001
-41661-ANAE501-*
-A2AE501
-A3AE501
-A4AE501
-A5AE501
-A6AE501
-A7AE501
-A8AE501
-A9AE501
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Untitled
Abstract: No abstract text available
Text: This document was generated on 05/18/2011 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: 0459704305 Active Overview: Description: searay SeaRay Plug Assy 10x40x3.4 Tin Voids Documents: 3D Model Drawing PDF Product Specification PS-45970-001 (PDF)
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10x40x3
PS-45970-001
PS-45970-002
AS-45970-001
AS-45970-002
AS-45970-990
TS-45970-001
TS-45970-002
LR19980
E2917n
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B17C
Abstract: A5l102 48-7191 5241 kk A17a A18E AND501 A10E A17E PK-41661-001
Text: PIN NUMBER 2161-1 102 PIN LENGTH 19.0/.750 PLATING 102 MATING “M” 11.43/.450 PCB “P” 4.37/.172 GOLD “G” N/A TIN “T” OVERALL PACKAGING PK-41661-001 STATUS A-41661-ANA102-* MATERIAL ENGINEERING VOIDS 26-48-1021 26-48-1031 26-48-1041 26-48-1051
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PK-41661-001
-41661-ANA102-*
-A2A102
-A3A102
-A4A102
-A5A102
-A6A102
-A7A102
-A8A102
-A9A102
B17C
A5l102
48-7191
5241 kk
A17a
A18E
AND501
A10E
A17E
PK-41661-001
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES MOUNTING HIGH POWER FLANGELESS & CHIP DEVICES When mounting a flangeless device, it is important to obtain a solder joint between the device ground plane and the heat sink that is free of voids. Pretinning of the device ground plane and the heat sink is recommended. When soldering devices with platinum-silver
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22-61 molex
Abstract: 2071 LR19980 22-12-2121 22-05-2151
Text: 2.54mm .100" Pitch KK Solid Header FEATURES AND SPECIFICATIONS Features and Benefits • Sizes 2 to 28 circuits ■ 4094 with voids is 4494 Series ■ Various pin lengths available ■ Voided circuits available (contact Molex) 2.54mm (.100") Pitch C Electrical
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PDF
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PS-10-07
E29179
LR19980
Tin--25
Gold--100
64mon
22-61 molex
2071
LR19980
22-12-2121
22-05-2151
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3M DIP SOCKET
Abstract: No abstract text available
Text: 3M DIP Socket Screw Machine 100 Series • Accepts various DIP packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Inner contact aligned to maximize contact surface area • Optional seal tape for closed-body
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PDF
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TS-2115-02
3M DIP SOCKET
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A7910
Abstract: No abstract text available
Text: 10 2.00 ± 0 .0 8 NON-ACCUM 0 0 .7 1 1 0 .0 8 ROW A RECOMMENDED PCB LAYOUT ROW B NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.
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PS-79107
PK-70873-0180
30u70
75u71
50u71
15u70
A7910
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Untitled
Abstract: No abstract text available
Text: N D T E S iU n le s s o th e r w is e s p e c ifie d , IMMATERIAL: FLUOROPOLYMER, THERMOPLASTIC. COLOR BLACK. 2. PARTS SHALL BE FREE OF FLASH, VOIDS, SINKS, SHORTS, AND CRACKS. A | B INITIAL RELEASE |ADDED TABLE TO THE DRAWING. 0 .0 7 2 T_ J 4 9B 7/20/92 524
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1X20-011B-I
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Untitled
Abstract: No abstract text available
Text: 10 10 PART NO. V O ID P IN 8 7354-5011 * 2 5 , 45 & 8 7 3 5 4 -5 0 1 3 *24 . 4 I & LO C A TIO NS 46 42 CKT * l I D E N T . SEAGATE PART NO. & REV. LETTER *4 4 TBD *40 TBD NOTES: 1. PART IS TO BE ASSEMBLED WITH VOIDED CONTACT POSITIONS. VOIDS LOCATION REFER TO CHART.
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SD-87354-5001
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LR19980
Abstract: molex kk 2695 22-12-2121
Text: m o l e x 2.54mm .10 0 " Pitch KK Header FEATURES AND SPECIFICATIONS feat ares and Benefits electrical • Sizes 2 to 28 circuits Voltage: 250V ■ 4 2 15 3 recommended for circuit sizes greater than 10 Current: 4 .0 A ■ 4094 with voids is 449 4 Series
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PDF
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PS-10-07
E29179
LR19980
20mi2
LR19980
molex kk 2695
22-12-2121
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SMES-152
Abstract: I-014
Text: 4 1662 PACING TAB EE NOTE 6 A -4 1 6 6 2 - * N PACKAGING AND OPTION: JT L •VOID LOCATIO NS BLANK=N0 VOIDS NO.=CKT. NO. VOIDED MULT. VOIDS STA R T WITH 51 NO.OF CKTS - 1 VIEW A PIN DIMENSIONS A B 1.3 C E N T E R L I N E OF PIN IN AREA SHOWN .05 NOT TO VARY FORM C E N T E R L I N E OF
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-A24DI02
-A24KI02
SDA-41662
1662X4
SMES-152
I-014
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Untitled
Abstract: No abstract text available
Text: UNLESS OTHERWISE NOTED TITLE: DIMENSIONS ARE IN INCHES X X SH EE T I I ±5 I 71_ .005 .0020 X X X iru ± RSM-1XX-KX- •.0240 [0.610] X ,075[1.91] DP VOIDS MAY OR MAY NOT BE P RESEN T IN THIS AREA mn n n n n n n n n m t FOUR P LA C E DECIMALS: 1 OF 2
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EXISPR0D\ASSEMBLA050
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26511
Abstract: 2651I SMES-152 265-1107 A20A
Text: II 12 10 9 7 8 6 1 41711 2 3 1 A-4 17 11-* N * * - * PACKAGING AND O PTIO N SSPACING TAB S EE NOTE 8 •- VOID LOCATIONS BLANK=NO VOIDS MULT. VOIDS ST A R T WITH 51 NO.=CKT. NO. VOIDED NO. OF CKTS J PIN DIMENSIONS A B 3 .96 .156 ( 7.92 .312 ( 11.89 .468
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26-5I-IIB7
26-51-HBO
26-5I-I0B4
26511
2651I
SMES-152
265-1107
A20A
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AH41
Abstract: No abstract text available
Text: A-41662-* N * * - * CIRCUIT I PACKAGING AND OPTIONS— I VOID LOCATIONS: BLANK = NO VOIDS NO.- CKT NO. VOIDED MULT. VOIDS S T A R T WITH 51 NO. OF CKTS. rrrrTTTR □ n n n n nn ~ ru 7.62 .300 PIN DIMENSIONS — ±0.05 ± .0 0 2 1 PLATING r u 3.96 ±0.05 .156 ±.002
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SD-41662-001
AH41
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