Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    WAFER FAB PLANT CODES Search Results

    WAFER FAB PLANT CODES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DM7842J/883 Rochester Electronics LLC DM7842J/883 - BCD/Decimal Visit Rochester Electronics LLC Buy
    9310FM Rochester Electronics LLC 9310 - BCD Decade Counter (Mil Temp) Visit Rochester Electronics LLC Buy
    54LS48J/B Rochester Electronics LLC 54LS48 - BCD-to-Seven-Segment Decoders Visit Rochester Electronics LLC Buy
    TLC32044IFK Rochester Electronics LLC PCM Codec, 1-Func, CMOS, CQCC28, CC-28 Visit Rochester Electronics LLC Buy
    TLC32044IN Rochester Electronics LLC PCM Codec, 1-Func, CMOS, PDIP28, PLASTIC, DIP-28 Visit Rochester Electronics LLC Buy

    WAFER FAB PLANT CODES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NATIONAL SEMICONDUCTOR MARKING CODE sot

    Abstract: national marking code P9506AB national marking code 8 soic NATIONAL SEMICONDUCTOR MARKING CODE S9506AB M51AB On semiconductor date Code national marking date code M9506AB
    Text: Page 1 of 4 QA/Product Engineering Europe COMPONENT COMPONENTMARKING MARKING Components are marked - on front side - full name or coded - one or more lines M9506AB LM2901N First Line of Marking Examples: Standard NS U M51AB LM2901M S9506AB SM9448AH Z XX YY TT


    Original     		PDF M9506AB LM2901N M51AB LM2901M S9506AB SM9448AH M51AA 20lead OT-23, OT-223, NATIONAL SEMICONDUCTOR MARKING CODE sot national marking code P9506AB national marking code 8 soic NATIONAL SEMICONDUCTOR MARKING CODE S9506AB M51AB On semiconductor date Code national marking date code M9506AB

    NATIONAL SEMICONDUCTOR MARKING CODE sot

    Abstract: national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS
    Text: Device Marking Conventions National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on the size of the device package


    Original     		PDF CSP-9-111S2) CSP-9-111S2. NATIONAL SEMICONDUCTOR MARKING CODE sot national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS

    alpha POTENTIOMETERS

    Abstract: ALPHA YEAR DATE CODE ALPHA YEAR CODE trace code alpha week code 8309 marking code 8P marking code 8T g8 marking code 8323 soic
    Text: Date Code Summary Date Codes for Bourns products are explained below. Trimpot® Products Trimmers, Switches, Modular Contacts and Linear Motion Potentiometers 4-Digit Date Code .- First two digits indicate year of manufacture;


    Original     		PDF 0808C alpha POTENTIOMETERS ALPHA YEAR DATE CODE ALPHA YEAR CODE trace code alpha week code 8309 marking code 8P marking code 8T g8 marking code 8323 soic

    SIP 8R 8C

    Abstract: ALPHA YEAR DATE CODE 0814 de marking code 8T g8 marking code 8309 8r 8050 lm 8344 MANUFACTURE LOGO marking CODE Y8
    Text: Bourns Date Code Summary Please find the Date Code explanation for the different Product Lines. Product Line: Trimpot ® including Trimmers, Switches, Modular Contacts and Linear Motion Potentiometers 4-Digit date code: example: 3-Digit date code: example:


    Original     		PDF 0808C S0832 SIP 8R 8C ALPHA YEAR DATE CODE 0814 de marking code 8T g8 marking code 8309 8r 8050 lm 8344 MANUFACTURE LOGO marking CODE Y8

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
    Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality


    Original     		PDF

    STMicroelectronics marking code date

    Abstract: Date Code Marking STMicroelectronics marking code stmicroelectronics STMicroelectronics marking code date me STMicroelectronics date marking CODE LOT code stmicroelectronics STMicroelectronics code date marking STMicroelectronics PRODUCT code date Part Marking STMicroelectronics STMicroelectronics date CODE
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/1160 Notification Date 06/10/2005 ADDITION OF 2ND SOURCE FOR ASSEMBLY AND TEST MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/1160 - Notification Date 06/10/2005 Table 1. Change Identification Product Identification


    Original     		PDF MLD-MIC/05/1160 MLD-MIC/05/1160 uPSD3200 uPSD3300 uPSD3400 STMicroelectronics marking code date Date Code Marking STMicroelectronics marking code stmicroelectronics STMicroelectronics marking code date me STMicroelectronics date marking CODE LOT code stmicroelectronics STMicroelectronics code date marking STMicroelectronics PRODUCT code date Part Marking STMicroelectronics STMicroelectronics date CODE

    5962-8867001LA cypress

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure PALC22V10-25PI 5962-8867001LA Mil-Std-883 Wire Bond Pull Method 2011 cypress part marking CY7C122 PALC22V10 visual inspection of raw materials MIL-STD-883 Method 2010
    Text: Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality and reliability. If you, the user, are not satisfied with every


    Original     		PDF

    EPF8452A

    Abstract: ALTERA PART MARKING dice project
    Text: CL8000 TECHNOLOGY WHITE PAPER Key Features u Fast Cycle Times: Development and Production u Easy Development with Altera FLEX 8000 u No Minimums u No NRE u Low power u No Test Vector Development u No Circuit Board Changes Required u Mix and Match With FLEX 8000


    Original     		PDF CL8000 EPF8452A CL8452A. CL8K03 ALTERA PART MARKING dice project

    INCOMING RAW MATERIAL INSPECTION checklist

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION report format ISO calibration certificate formats MATERIAL CONTROL PROCEDURE document standard operating procedure organizational chart
    Text: ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. E 15-5 ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. E 15-6 ISO 9001 QUALITY MANUAL QUALITY SYSTEM FOR DESIGN, DEVELOPMENT, PRODUCTION, AND SERVICING 0 INTRODUCTION 3.0 DEFINITIONS This policy defines the organization and policies of Linear


    Original     		PDF

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION report format MATERIAL CONTROL PROCEDURE Sample form for INCOMING Inspection of RAW MATERIAL plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTIONs INCOMING MATERIAL INSPECTION procedure incoming material checklist
    Text: ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. F 15-5 ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. F 15-6 ISO 9001 QUALITY MANUAL QUALITY SYSTEM FOR DESIGN, DEVELOPMENT, PRODUCTION, AND SERVICING 0 INTRODUCTION 3.0 DEFINITIONS This policy defines the organization and policies of Linear


    Original     		PDF

    INCOMING RAW MATERIAL INSPECTION format

    Abstract: INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION procedure MATERIAL CONTROL PROCEDURE INCOMING RAW MATERIAL INSPECTION report format smd code book 1426 ltc lot number format INCOMING RAW MATERIAL INSPECTIONs INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION form
    Text: ISO 9001 Quality Manual QUALITY SYSTEM FOR DESIGN, DEVELOPMENT, PRODUCTION, AND SERVICING 0 INTRODUCTION 3.0 DEFINITIONS This policy defines the organization and policies of Linear Technology Corporation LTC and assures conformance to requirements during design, development, production,


    Original     		PDF

    transistor A562

    Abstract: A561 transistor trapatt diode A4 transistor A562 transistor transistor a561 transistor smd marking a73 reverse-conducting thyristor trapatt A5 DIODE
    Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 20 April 2011. INCH-POUND MIL-PRF-19500P 20 October 2010 SUPERSEDING MIL-PRF-19500N 30 November 2005 PERFORMANCE SPECIFICATION SEMICONDUCTOR DEVICES,


    Original     		PDF MIL-PRF-19500P MIL-PRF-19500N transistor A562 A561 transistor trapatt diode A4 transistor A562 transistor transistor a561 transistor smd marking a73 reverse-conducting thyristor trapatt A5 DIODE

    GEC Marconi Materials Technology

    Abstract: ford ppap INCOMING RAW MATERIAL specification in-process quality control ford motor company Ford in-process quality INCOMING RAW MATERIAL INSPECTION procedure ford m Nokia 9000 INCOMING RAW MATERIAL INSPECTION procedure work instruction raw material stores delco semiconductors
    Text: BRIEF HISTORY of HARRIS SEMICONDUCTOR The modern-day Harris Corporation has its roots in Radiation, Inc., an electronics company formed in Melbourne, Florida, in 1950. Radiation was founded shortly after the first rocket was launched from Cape Canaveral. The company's original staff of 12 employees pioneered the


    Original     		PDF

    development trends in car manufacture

    Abstract: No abstract text available
    Text: W h a t i s d r i v i n g S e m t e c h ’s s u c c e s s S E M T E C H C O R P O R AT I O N 1999 Annual Repor t 1 Shareholders’ Equity in thousands in millions 96 97 98 99 95 96 97 98 99 95 96 $34 $25 $14 $55 $80 $12,895 $1,502 $8,487 $7,531 $115 $72 $62


    Original     		PDF

    diode Marking code v3

    Abstract: sot 23-5 marking code H5 V = Device Code marking H5 sot 23-5 Wafer Fab Plant Codes ST fairchild mos xaa64 MC74HC1G14
    Text: MC74HC1G14 Inverter with Schmitt-Trigger Input The MC74HC1G14 is a high speed CMOS inverter with Schmitt–Trigger input fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent LSTTL while maintaining CMOS low power dissipation.


    Original     		PDF MC74HC1G14 MC74HC 353/SC diode Marking code v3 sot 23-5 marking code H5 V = Device Code marking H5 sot 23-5 Wafer Fab Plant Codes ST fairchild mos xaa64

    V = Device Code

    Abstract: vsop8 package outline Wafer Fab Plant Codes ST 14XXX T138A
    Text: MC74VHC1G86 2-Input Exclusive OR Gate The MC74VHC1G86 is an advanced high speed CMOS 2–input Exclusive OR gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.


    Original     		PDF MC74VHC1G86 353/SC V = Device Code vsop8 package outline Wafer Fab Plant Codes ST 14XXX T138A

    V = Device Code

    Abstract: No abstract text available
    Text: MC74VHC1G02 2-Input NOR Gate The MC74VHC1G02 is an advanced high speed CMOS 2–input NOR gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.


    Original     		PDF MC74VHC1G02 353/SC V = Device Code

    V = Device Code

    Abstract: MC74VHC1G00
    Text: MC74VHC1G00 2-Input NAND Gate The MC74VHC1G00 is an advanced high speed CMOS 2–input NAND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.


    Original     		PDF MC74VHC1G00 353/SC V = Device Code

    wz 74 marking

    Abstract: t138a V = Device Code
    Text: MC74HC1G02 2-Input NOR Gate The MC74HC1G02 is a high speed CMOS 2–input NOR gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent LSTTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer


    Original     		PDF MC74HC1G02 MC74HC 353/SC wz 74 marking t138a V = Device Code

    marking t132

    Abstract: marking code V6 diode MC74VHC1G08 V = Device Code
    Text: MC74VHC1G08 2-Input AND Gate The MC74VHC1G08 is an advanced high speed CMOS 2–input AND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.


    Original     		PDF MC74VHC1G08 353/SC marking t132 marking code V6 diode V = Device Code

    vsop8 package outline

    Abstract: vsop8 V = Device Code SOT 363 marking CODE LA marking h8 Wafer Fab Plant Codes ST marking 62 ON Semi diode Marking code v3 hep08 marking code vhc
    Text: MC74VHC1G09 2-Input AND Gate with Open Drain Output The MC74VHC1G09 is an advanced high speed CMOS 2–input AND gate with open drain output fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.


    Original     		PDF MC74VHC1G09 vsop8 package outline vsop8 V = Device Code SOT 363 marking CODE LA marking h8 Wafer Fab Plant Codes ST marking 62 ON Semi diode Marking code v3 hep08 marking code vhc

    H2D MARKING CODE

    Abstract: marking code V6 DIODE V = Device Code H2D Marking diode Marking code v3
    Text: MC74HC1G08 2-Input AND Gate The MC74HC1G08 is a high speed CMOS 2–input AND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent LSTTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer


    Original     		PDF MC74HC1G08 MC74HC 353/SC H2D MARKING CODE marking code V6 DIODE V = Device Code H2D Marking diode Marking code v3

    marking CODE W2D

    Abstract: marking w2d
    Text: MC74VHC1G126 Noninverting 3-State Buffer The MC74VHC1G126 is an advanced high speed CMOS noninverting 3–state buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power


    Original     		PDF MC74VHC1G126 353/SC marking CODE W2D marking w2d

    Wafer Fab Plant Codes ST

    Abstract: V = Device Code T138-A marking 563 fairchild ALPHA NEW YEAR DATE CODE marking t132 marking sbn DIODE M7 SMP HEP08
    Text: MC74HC1G32 2-Input OR Gate The MC74HC1G32 is a high speed CMOS 2–input OR gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent LSTTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer


    Original     		PDF MC74HC1G32 MC74HC 353/SC Wafer Fab Plant Codes ST V = Device Code T138-A marking 563 fairchild ALPHA NEW YEAR DATE CODE marking t132 marking sbn DIODE M7 SMP HEP08