2x14
Abstract: No abstract text available
Text: Wafer and Die Infosheet Memory Products Features • Async SRAMs, Dual-Ports, FIFOs, MicroPower SRAMs, PROMs, and Sync SRAMs wafer and die • Wafer — Standard Wafer 25–30 mil thick — Background Wafer to 14 mil thick — Background Wafer to 11 mil thick
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CYXXXX
Abstract: No abstract text available
Text: Wafer and Die Infosheet Memory Products Features • Async SRAMs, Dual-Ports, FIFOs, MicroPower SRAMs, PROMs, and Sync SRAMs wafer and die • Wafer — Standard Wafer 25–30 mil thick — Background Wafer to 14 mil thick — Background Wafer to 11 mil thick
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Abstract: No abstract text available
Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 1 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick
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Abstract: No abstract text available
Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 2 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick
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Abstract: No abstract text available
Text: R Silicon Wafer Mapping Sensor F3M-S825-1 Allows Simultaneous Mapping of Up to 25 Silicon Wafers H Economical—one sensor detects most wafer types H 200 mm wafer size H Automatic and remote teaching capability H Self-diagnostic functions reduce downtime Ordering Information
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F3M-S825-1
35-mm
F3M-S825-1
F3M-S825-1,
1-800-55-OMRON
D063-E3-825
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G85-0703
Abstract: g85 wafer G81-0703 G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2
Text: TN-00-21: SEMI-Defined Wafer Map Format Introduction Technical Note SEMI -Defined Wafer Map Format Introduction Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International SEMI® . Using a mapping format defined by a worldwide
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TN-00-21:
G81-0703
G85-0703
09005aef81d8ff80/Source:
09005aef81d8ff52
TN0021
g85 wafer
G85 wafer format
XML G85
TN-00-21
wafer map format
G81 wafer format
substrate
123456705F2
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Untitled
Abstract: No abstract text available
Text: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability
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76-mm
F3M-S625
F3M-S626
F3M-S825
F3M-S826
F3M-S1213
F3M-S1225
35-roperties
1-800-55-OMRON
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OCI 531
Abstract: m1b marking s1225 IEC60529 F3M-S1213 F3M-S1225
Text: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability
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76-mm
F3M-S625
35-mm
F3M-S626
F3M-S825
F3M-S826
F3M-S1213
1-800-55-OMRON
OCI 531
m1b marking
s1225
IEC60529
F3M-S1213
F3M-S1225
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E5-1101
Abstract: wafer prober AN115013 WM-40X0 SECS II wafer map format wafer map format wafer map 3d01
Text: AN115013 SECS II wafer map format Rev. 1.3 — 1 July 2009 Application note Document information Info Content Keywords wafer mapping, SECS II format, electronic inking Abstract This document gives a short guideline how to interpret wafer maps in SECS II format delivered with wafers by Business Line Identification.
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AN115013
E5-1101
wafer prober
AN115013
WM-40X0
SECS II wafer map format
wafer map format
wafer map
3d01
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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DS-L10H
Abstract: DS-L24H DS-L10 AP3822K RELAY SOCKET DIAGRAM CK-100 SH-72 DIODE MSDS CK100 transistor DIAGRAM ck100 transistor npn silicon ck100
Text: SERIES Wafer Detection Sensor SH-72 DS FD-L41/L42 Glass Sheet / Wafer Sensing PARTICULAR USE SENSORS DS GD Optimum for Wafer Detection Reliable Fixed-focus Sensing A Variety of Objects The sensor can reliably detect wafers irrespective of their glossiness or color.
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SH-72
FD-L41/L42
CK-100
DS-L24H
2-M30
DS-L10H
DS-L24H
DS-L10
AP3822K RELAY SOCKET DIAGRAM
CK-100
SH-72
DIODE MSDS
CK100 transistor DIAGRAM
ck100 transistor
npn silicon ck100
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression special type Wafer mapping sensor light source pulsed red laser diode
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30consumption
16N5651
16P5651
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Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis sample picture general data type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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range of laser sensor
Abstract: laser sensor accuracy laser temperature sensor
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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16N5651
16P5651
range of laser sensor
laser sensor accuracy
laser temperature sensor
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Untitled
Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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16N5651
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Untitled
Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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16N5651
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OHDM
Abstract: 16P56
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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16N5651
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OHDM
16P56
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Abstract: No abstract text available
Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis sample picture general data type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw
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scfm 50 10 kv
Abstract: No abstract text available
Text: APS/SPS200TESLA 200 mm Fully-Automated On-Wafer Probing Solution for High-Power Devices DATA SHEET The APS/SPS200TESLA is the industry’s irst fully-automated on-wafer probing solution focused on production performance for high-power semiconductors. The APS/SPS200TESLA improves productivity and yield at inal test by enabling production wafer
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APS/SPS200TESLA
APS/SPS200TESLA
APS/SPS200TESLA-DS-1113
scfm 50 10 kv
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LB-412
Abstract: ICODE SLI ICS20 SL2ICS20 IBIS wafer map format
Text: INTEGRATED CIRCUITS ADDENDUM SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification Product Specification Revision 3.0 Public Philips Semiconductors December 2002 Philips Semiconductors Product Specification Rev.3.0 December 2002 Bumped Wafer Specification
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SCA74
LB-412
ICODE SLI
ICS20
SL2ICS20
IBIS wafer map format
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