W-CSP footprint
Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320â
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
TLV5614IYZ
Abstract: No abstract text available
Text: TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green FEATURES APPLICATIONS • Four 12-Bit D/A Converters • Programmable Settling Time of Either 3µs or 9µs Typ
|
Original
|
TLV5614IYZ
SBAS401
12-Bit,
12-Bit
TMS320TMDSP
TLV5614IYZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389 – JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
wcsp qualification
Abstract: TLV5610 TLV5610IDW TLV5610IYE TLV5610IYZ TMS320
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
wcsp qualification
TLV5610
TLV5610IDW
TLV5610IYE
TLV5610IYZ
TMS320
|
PDF
|
WCSP-20
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
WCSP-20
|
PDF
|
WCSP-20
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
WCSP-20
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
WCSP-20
Abstract: Application-SBVA017
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
WCSP-20
Application-SBVA017
|
PDF
|
TLV5610
Abstract: TLV5610IDW TLV5610IYE TLV5610IYZ TMS320 Application-SBVA017
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
TLV5610
TLV5610IDW
TLV5610IYE
TLV5610IYZ
TMS320
Application-SBVA017
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320TM
|
PDF
|
TLV5614IYZ
Abstract: No abstract text available
Text: TLV5614IYZ www.ti.com SBAS401 – DECEMBER 2006 12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die Wafer Chip Scale Package—Pb-Free/Green FEATURES APPLICATIONS • Four 12-Bit D/A Converters • Programmable Settling Time of Either 3µs or 9µs Typ
|
Original
|
TLV5614IYZ
SBAS401
12-Bit,
12-Bit
TMS320â
TLV5614IYZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320â
|
PDF
|
Untitled
Abstract: No abstract text available
Text: BurrĆBrown Products from Texas Instruments TLV5610IYZ SBAS389A – JULY 2006 – REVISED JULY 2006 2.7V to 5.5V, 12-Bit, Octal DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Package—Pb-Free/Green FEATURES APPLICATIONS • • • • • • • •
|
Original
|
TLV5610IYZ
SBAS389A
12-Bit,
TLV5610IYE
TMS320â
|
PDF
|
SN74LVC2G04-EP
Abstract: No abstract text available
Text: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C
|
Original
|
SN74LVC2G04-EP
SGLS365
24-mA
|
PDF
|
SN74LVC2G04-EP
Abstract: No abstract text available
Text: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C
|
Original
|
SN74LVC2G04-EP
SGLS365
24-mA
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SN74LVC1G02-EP SINGLE 2-INPUT POSITIVE-NOR GATE www.ti.com SGLS370 – AUGUST 2006 • • • • • • FEATURES • • • • • • 1 Controlled Baseline – One Assembly – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C
|
Original
|
SN74LVC1G02-EP
SGLS370
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SN74LVC1G02-EP SINGLE 2-INPUT POSITIVE-NOR GATE www.ti.com SGLS370 – AUGUST 2006 • • • • • • FEATURES • • • • • • 1 Controlled Baseline – One Assembly – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C
|
Original
|
SN74LVC1G02-EP
SGLS370
|
PDF
|
SN74LVC2G04-EP
Abstract: No abstract text available
Text: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C
|
Original
|
SN74LVC2G04-EP
SGLS365
24-mA
|
PDF
|
SN74LVC2G04-EP
Abstract: No abstract text available
Text: SN74LVC2G04-EP DUAL INVERTER GATE www.ti.com SGLS365 – AUGUST 2006 FEATURES • • • • • • • • • • • • • • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C
|
Original
|
SN74LVC2G04-EP
SGLS365
24-mA
|
PDF
|