Untitled
Abstract: No abstract text available
Text: TaNSil WIRE BONDABLE SILICON CHIP RESISTORS ISO-9001 Registered WBC SERIES • Highly reliable aluminum bond pads Gold bond pads available • Discrete or tapped schematics • Ultra-stable TaNSil® resistors on silicon • MIL screening available • High resistor density
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ISO-9001
selfpassivaR0202:
10-100K
T0303:
10-100K
R0202
T0303
T0303AS
T0303
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Untitled
Abstract: No abstract text available
Text: TaNSil Wire Bondable W NE Silicon Chip Resistors WBC SERIES ● Ultra-stable TaNSil® resistors on silicon ● MIL screening available ● High resistor density ● Highly reliable aluminium bond pads Gold bond pads available ● Discrete or tapped schematics
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R0202
extremely00k
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PDF
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Untitled
Abstract: No abstract text available
Text: TaNSil Wire Bondable Silicon Chip Resistors Welwyn Components WBC Series • Ultra-stable TaNSil® resistors on silicon • MIL screening available • High resistor density • Highly reliable aluminium bond pads Gold bond pads available • Discrete or tapped schematics
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R0202
T0303
R0202/
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME
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25ppm/Â
106-F-0306
AT-10001F-G
50ppm/Â
10ppm/Â
100ppm/Â
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME
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Original
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25ppm/
50ppm/
10ppm/
100ppm/
106-F-0306
T-10001F-G
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT 0.035" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME
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50ppm/
25ppm/
10ppm/
100ppm/
106-D-1198
T-10001F-G
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
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Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
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08-Apr-05
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WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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MIL-STD-883.
08-Apr-05
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Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
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18-Jul-08
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material composition of chip capacitors
Abstract: No abstract text available
Text: GLOSSARY Active Component: Active Trim: Alumina: Analog Circuit: Bond: Burn-in: Ceramic Package: Cermetic Package: Chip: Chip-and-wire: Clean room: Cofired Ceramic Package: Conformal Coating: Constant Acceleration Centrifuge : Die: Digital Circuit: Encapsulate:
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Untitled
Abstract: No abstract text available
Text: Construction of MSI Precision Chip Resistors 4. Bondability All resistors are fabricated with the resistor film sandwiched between a bottom conductor and a top conductor termination. This construction exposes the maximum bond pad area for multiple wire bonds,
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CC2015FC
Abstract: CC2520 CC1512FC CC2015WB CC2520FC
Text: Type CC Low Resistance Precision Chip Resistors Page 1 of 2 • Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination
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EIA-481-1.
IL106
CC2015FC
CC2520
CC1512FC
CC2015WB
CC2520FC
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PDF
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Untitled
Abstract: No abstract text available
Text: Type CC Low Resistance Precision Chip Resistors Page 1 of 2 • Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination
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EIA-481-1.
IL106
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GP SERIES RESISTORS
Abstract: No abstract text available
Text: High Temperature Chip Resistor HTCR Series Temperature Chip Chip Resistor Resistor High Temperature • High temperature operation to 250°C ·HTCR For gold wire bond G type Series Series · For conductive adhesive (G, P & EW types) temperature operationto
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to250
to10M
GP SERIES RESISTORS
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Untitled
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment
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100ppm/
-10001F-E
2ST-10001F-E
105-F-0306
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Untitled
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment
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100ppm/
2ST-10001F-E
-10001F-E
105-D-1198
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F0306
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment
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100ppm/
-10001F-E
2ST-10001F-E
105-F-0306
F0306
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PDF
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Untitled
Abstract: No abstract text available
Text: RESISTOR 125 WATTS CVD DIAMOND DATA SHEET PART NUMBER: FEATURES Small Size – Light Weight Highest Thermal Performance Possible Excellent Peak Power Capability Rugged Passivated TaN Film Moisture Resistant Pure Gold Input Pads Wire Bond or Solderable High Power
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CR1010D
CR1010D
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PDF
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Untitled
Abstract: No abstract text available
Text: High Temperature Chip Resistor HTCR Series Temperature Chip Chip Resistor Resistor High Temperature • High temperature operation to 250°C ·HTCR For gold wire bond G type Series Series · For conductive adhesive (G, P & E types) temperature operationto
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to250
to10M
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WTVA0300N06WB2
Abstract: WTVA0200N06WB2 WTVA0600N06WB2 WTVA MTVA0300N06WB1 ETVA Stripline Flange Terminations PST-02 PLANAR MTVA0300
Text: EMC Technology - WTVA0300N06WB2 - Page 1 of 3 Contact Request | Request For Quote | Sample Request | Search [ ] [Go] Home Products Thermopad Standard Thermopad® TVA Planar Triple Wrap Single Wrap Gold Planar Wire Bond Gold ETVA MTVA Planar Triple Wrap Single
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WTVA0300N06WB2
1-877-F
WTVA0200N06WB2
WTVA0600N06WB2
MTVA0300N06WB1
\CPR\08182010
18-Aug-2010
WTVA0600N06WB2
WTVA
MTVA0300N06WB1
ETVA
Stripline Flange Terminations
PST-02
PLANAR
MTVA0300
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PDF
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Untitled
Abstract: No abstract text available
Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi
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15x15
20x20
22x22
QDD02M7
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