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    WIRE BOND SHEAR Search Results

    WIRE BOND SHEAR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MP-5XRJ11PPXS-014 Amphenol Cables on Demand Amphenol MP-5XRJ11PPXS-014 Flat Silver Satin Modular Crossed wiring Cable, RJ11 / RJ11 14ft Datasheet
    MP-64RJ4528GB-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GB-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Blue 3ft Datasheet
    MP-64RJ4528GG-014 Amphenol Cables on Demand Amphenol MP-64RJ4528GG-014 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Green 14ft Datasheet
    MP-64RJ4528GR-007 Amphenol Cables on Demand Amphenol MP-64RJ4528GR-007 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Red 7ft Datasheet
    MP-64RJ4528GY-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GY-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Yellow 3ft Datasheet

    WIRE BOND SHEAR Datasheets Context Search

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    MVL3030

    Abstract: MVL3030X103MGH5N MVL3030Y104ZGH5R military capacitor codes mvl4 MVL3030Y104 MVL3030X103
    Text: "VL" Series Vertical Layer Capacitors Wire Bondable DC Decoupling Capacitors Presidio Advantage PERFORMANCE: MVL3030X103MGH5N-* Bond Wires Included Insertion Loss Data in Shunt 7169 Construction Court, San Diego, CA 92121 USA • Tel: 858-578-9390 • Fax: 800-538-3880 or 858-578-6225


    Original     		PDF MVL3030X103MGH5N-* MVL4080X104MGH5N-* Mil-C-49464/55681 Mil-Std-202 MVL3030 MVL3030X103MGH5N MVL3030Y104ZGH5R military capacitor codes mvl4 MVL3030Y104 MVL3030X103

    presidio X7R

    Abstract: MVL3030X103MGH5N
    Text: "VL" Series Vertical Layer Capacitors Wire Bondable DC Decoupling Capacitors Presidio Advantage PERFORMANCE: MVL3030X103MGH5N-* Bond Wires Included Insertion Loss Data in Shunt 7169 Construction Court, San Diego, CA 92121 USA • Tel: 858-578-9390 • Fax: 800-538-3880 or 858-578-6225


    Original     		PDF MVL3030X103MGH5N-* MVL4080X104MGH5N-* Mil-C-49464/55681 Mil-Std-202 presidio X7R MVL3030X103MGH5N

    Presidio Components CAP

    Abstract: MVL3030X103MGH5N capacitor North Dakota military capacitor codes
    Text: "VL" Series Vertical Layer Capacitors Wire Bondable DC Decoupling Capacitors Presidio Advantage PERFORMANCE: MVL3030X103MGH5N-* Bond Wires Included Insertion Loss Data in Shunt 7169 Construction Court, San Diego, CA 92121 USA • Tel: 858-578-9390 • Fax: 800-538-3880 or 858-578-6225


    Original     		PDF MVL3030X103MGH5N-* MVL4080X104MGH5N-* Mil-C-49464/55681 Mil-Std-202 16-Aug-2010 Presidio Components CAP MVL3030X103MGH5N capacitor North Dakota military capacitor codes

    Untitled

    Abstract: No abstract text available
    Text: G E N E R A L S P E C I F I C AT I O N S Mechanical Characteristics Resistance to Solvents: ATC’s dielectrics are virtually unaffected by moisture and commonly used cleaning solvents. Bond Strength: All terminations meet or exceed MIL-STD-883 Method 2019 for Die Shear Strength. Wire bondability meets or


    Original     		PDF MIL-STD-883 ML-C-49464 MIL-STD-883 MIL-C-49464. MIL-C-49464)

    GaSn

    Abstract: APN0010 E3633A G751 HV14 NCA-1101443-0202A
    Text: Application Notes HV14 OptoCooler NCA-1101443-0202A_A gold wire bond compatible Extraction from a Gelpak Tweezer contact with the top header of the HV14 module should be avoided. Typical laboratory tweezers with large tweezer blades are not compatible with extracting HV14 modules. Referring to Fig. 1, it is obvious that the


    Original     		PDF NCA-1101443-0202A APN0010 GaSn E3633A G751 HV14

    ABLEBONd 84-1

    Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l

    ABLEBONd 84-1

    Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S

    Die Attach epoxy stamping

    Abstract: national semiconductor handbook national application handbook wire bond LM117 goodrich resin ltcc chip copper bond wire DIE ATTACH National Semiconductor Top Mark
    Text: Considerations in Implementing Chip-on-Board and Multi-Die Assemblies Mark McClintick Process Engineer September 17, 2003 Agenda • Manufacturing flow overview • Process considerations • General layout approaches • Thermal considerations 2 2003 National Semiconductor Corporation


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    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
    Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .


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    3M Double Coated Urethane Foam Tape 4026

    Abstract: power bond 4026 datasheet polypropylene foam msds light yellow foam tape 02150285 Double Coated Urethane Foam Tapes 3M 4032 4016 3m
    Text: 3 Double Coated Urethane Foam Tapes 4004 • 4008 • 4016 • 4026 4032 • 4052 • 4056 • 4085 Technical Data February, 2005 Product Description 3M Double Coated Urethane Foam Tapes are conformable foams that offer high shear strength and are available with either a high temperature holding acrylic


    Original     		PDF 1-1W-10, 3M Double Coated Urethane Foam Tape 4026 power bond 4026 datasheet polypropylene foam msds light yellow foam tape 02150285 Double Coated Urethane Foam Tapes 3M 4032 4016 3m

    4016

    Abstract: 3M 4026 3M Double Coated Urethane Foam Tape 4026 adhesive rubber based msds 3M 4032 4016 3m 3M 4016
    Text: 3 Double Coated Urethane Foam Tapes 4004 • 4008 • 4016 • 4026 4032 • 4052 • 4056 • 4085 Technical Data April, 2009 Product Description 3M Double Coated Urethane Foam Tapes are conformable foams that offer high shear strength and are available with either a high temperature holding acrylic


    Original     		PDF 225-3S-06 4016 3M 4026 3M Double Coated Urethane Foam Tape 4026 adhesive rubber based msds 3M 4032 4016 3m 3M 4016

    SW7 357

    Abstract: HV803 ausi die attach CSI 2702 HV208 HV82 38495 VF01 VP03 AF03
    Text: Chapter 19 – Die Specifications DMOS Die Specifications Selector Guide VF01/VF06/VF21/VF25 VF22/LND1/LP07 VF05/VF13/VF26/TN07 VF32/LNE1/LP08 AF03 LR6 LR7 HT04 HV15/HV16/HV18 HV202 HV204/HV217/HV218/HV227/HV228 HV207 HV208 HV209 HV21/HV22 HV31/49 HV34 HV45/HV46


    Original     		PDF VF01/VF06/VF21/VF25 VF22/LND1/LP07 VF05/VF13/VF26/TN07 VF32/LNE1/LP08 HV15/HV16/HV18 HV202 HV204/HV217/HV218/HV227/HV228 HV207 HV208 HV209 SW7 357 HV803 ausi die attach CSI 2702 HV208 HV82 38495 VF01 VP03 AF03

    AN-1061

    Abstract: Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter
    Text: Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes By Richard Clark Table of Contents Page Introduction .1 Storage and Handling .2


    Original     		PDF AN-1061 AN-1061 Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter

    MSTF-2ST-10R00J-G

    Abstract: Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI
    Text: Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s Discussion Millimeterwave MMIC's are becoming more common in commercial applications. Their small size and potentially lower cost has made them valuable in the growing market of millimeterwave systems. Their size and delicate nature


    Original     		PDF D35BV102KPX MSTF-2ST-10R00J-G Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI

    9lprs

    Abstract: 9lprs477 9lprs387 9lprs365 9LRS3165 9lprs325 9LPRS355 9LPR 9lprs914 9LPRS918
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0903-04 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: May 8, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: 9 mm x 9 mm VFQFPN-64 Product Mark 10 mm x 10 mm VFQFPN-72


    Original     		PDF A0903-04 VFQFPN-64 VFQFPN-72 you6138 9LPR309 9LPR311 9LPR323 9LPR325 9LPR332 9lprs 9lprs477 9lprs387 9lprs365 9LRS3165 9lprs325 9LPRS355 9LPR 9lprs914 9LPRS918

    9LRS3199AKLFT

    Abstract: 9LvS3199aklft 9LRS3199 JESD22-B116 9lprs 9LRS3197 9LRS4116 vfqfpn-32 9LRS 9LvS3199
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0910-01 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 6, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: VFQFPN-20, 32, 40, 48, 56 Product Mark


    Original     		PDF A0910-01 VFQFPN-20, Conta05AKLF 9LRS4205AKLFT 9LVRS392AKLF 9LVRS392AKLFT 9LVRS393AKLF 9LVRS393AKLFT 9LVRS393BKLF 9LVRS393BKLFT 9LRS3199AKLFT 9LvS3199aklft 9LRS3199 JESD22-B116 9lprs 9LRS3197 9LRS4116 vfqfpn-32 9LRS 9LvS3199

    557g03lf

    Abstract: 557G-05ALF 557GI-03LFT 557GI-05ALFT 552G-02ILNT JESD22-B116 TSSOP-64 552G-02ILN MK2308G-1HLF JESD22-A110
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0903-01 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: May 15, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: 4.4 mm TSSOP 16, 20, 24 Product Mark (Standard & Green)


    Original     		PDF A0903-01 650GI-44LFT 650GI-44T 660GI 660GILF 660GILFT 660GIT 661GI 661GILF 661GILFT 557g03lf 557G-05ALF 557GI-03LFT 557GI-05ALFT 552G-02ILNT JESD22-B116 TSSOP-64 552G-02ILN MK2308G-1HLF JESD22-A110

    Die Attach epoxy stamping

    Abstract: 60022 pressure low die attach coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: Application Note Handling Gallium Arsenide Die Rev 2 INTRODUCTION Gallium arsenide die have physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding operations


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    INCOMING RAW MATERIAL INSPECTION chart

    Abstract: INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart LINEAR TECHNOLOGY mark code INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL aql incoming inspection mil-std-883 2015 Gold Ball Bond Shear
    Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS TO-92 Linear Technology Carsem Maylasia Linear Technology


    Original     		PDF MIL-STD-883 INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart LINEAR TECHNOLOGY mark code INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL aql incoming inspection mil-std-883 2015 Gold Ball Bond Shear

    INCOMING RAW MATERIAL INSPECTION

    Abstract: 7224 markem INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL flowchart Markem 7224 Ink INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method LINEAR TECHNOLOGY mark code asm chart INCOMING RAW MATERIAL
    Text: ATTACHMENT 2. ASSEMBLY FLOWCHART Pg. 1 of 3 INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS DD PACK Linear Technology Penang & Carsem Linear Technology


    Original     		PDF MIL-STD-883 INCOMING RAW MATERIAL INSPECTION 7224 markem INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL flowchart Markem 7224 Ink INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method LINEAR TECHNOLOGY mark code asm chart INCOMING RAW MATERIAL

    schematic WELDER

    Abstract: gold melting furnace ultrasonic bond
    Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter­ natives in the selection of diodes and packaging with each


    OCR Scan     		PDF OT-23 schematic WELDER gold melting furnace ultrasonic bond

    ultrasonic bond

    Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
    Text: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Packaging - Handling Gallium Arsenide Die Handling Gallium Arsenide Die Gallium arsenide die have physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip


    OCR Scan     		PDF