maxim CODE TOP MARKING
Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
Text: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and
|
Original
|
DS2482-101:
DS2502:
DS2762:
com/an4002
AN4002,
APP4002,
Appnote4002,
maxim CODE TOP MARKING
Pb95Sn5
maxim TOP MARKING
garrou wafer-level packaging has arrived
Maxim ic date code
ANALOG DEVICES ASSEMBLY DATE CODE
philip IC marking
Maxim date code DS2431
dALLAS MARKING CODE
maxim assembly of code
|
PDF
|
IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications
|
Original
|
1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6011
IPC-D-279
IPC-6013
ipc 7094
IPC-6012
IPC-2223
IPC 6012
IPC-6016
IPC-2221
IPC-2222
|
PDF
|
IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
|
Original
|
1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
|
Original
|
SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
|
Original
|
SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
|
Original
|
SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
|
Original
|
SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
|
PDF
|
JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
|
Original
|
SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
|
PDF
|
JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
|
Original
|
SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
|
Original
|
ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
|
Original
|
ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
|
PDF
|
sac 405
Abstract: WLCSP flip chip IPACK2005 sensors mttf WLCSP chip mount SAC405 thetaja wlcsp "sac 405"
Text: The Effect of Electromigration on Eutectic SnPb and Pb-free Solders in Wafer Level-Chip Scale Packages Joanne Huang1, Stephen Gee2, Luu Nguyen2, King-Ning Tu1 1 Department of Materials Science and Engineering, University of California - Los Angeles, Los Angeles,
|
Original
|
IPACK200573417.
sac 405
WLCSP flip chip
IPACK2005
sensors mttf
WLCSP chip mount
SAC405
thetaja wlcsp
"sac 405"
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5144XZ 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm
|
Original
|
ES/SMM5144XZ
30GHz
ES/SMM5144XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
|
Original
|
SMM5139XZ
SMM5139XZ
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: ES/SMM5144XZ Preliminary 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm
|
Original
|
ES/SMM5144XZ
30GHz
ES/SMM5144XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
|
Original
|
SMM5139XZ
SMM5139XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Bal • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
|
Original
|
SMM5142XZ
SMM5142XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ES/SMM5143XZ Preliminary 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm
|
Original
|
ES/SMM5143XZ
30GHz
-12dB
24dBm
ES/SMM5143XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
|
Original
|
SMM5142XZ
SMM5142XZ
|
PDF
|
EIA standards 783
Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.
|
Original
|
AN1235
AN2348.
EIA standards 783
smd diode order marking code stmicroelectronics
EIA 481-C
bulk id
EIA standards 763
EIA 763
IEC-60286-3
WLCSP flip chip
WLCSP stencil design
st smd diode marking code
|
PDF
|
AN2348
Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.
|
Original
|
AN2348
AN1235.
AN2348
EIA standards 763
EIA 481-C
flip chip bga 0,8 mm
WLCSP stencil design
EIA 763
Service Manual smd rework station
WLCSP chip mount
WLCSP flip chip
BUT12
|
PDF
|
JEP95 MS-028
Abstract: No abstract text available
Text: ES/SMM5723XZ Preliminary 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
|
Original
|
ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
JEP95 MS-028
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
|
Original
|
SMM5722XZ
16GHz
50ohm
SMM5722XZ
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ES/SMM5724XZ Preliminary 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
|
Original
|
ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
|
PDF
|
