WLCSP PBO DESIGN Search Results

WLCSP PBO DESIGN Result Highlights (5)

Part	Manufacturer	Description
DE6B3KJ151KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ471KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6E3KJ152MN4A	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ101KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ331KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive

WLCSP PBO DESIGN Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
WLCSP flip chip Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters	Original	PDF
TEA5760 Abstract: PR73002 GH751 PR37156 TEA576x TEA5766 PM 438 BL TEA5766UK EIA 763 EIA-763 Text: TEA5766UK/N1 Product Information Package Author: A.J. v.d. Woude Date: 2006-10-09 Reference Number: RNB-C/2581/2006IX-0217 Version: 1.0 Status: Approved Approver: T. Wang Function: International Product Marketeer Document location: BL-PES Teamroom TEA5766	Original	PDF	TEA5766UK/N1 RNB-C/2581/2006IX-0217 TEA5766 TEA5760 PR73002 GH751 PR37156 TEA576x TEA5766 PM 438 BL TEA5766UK EIA 763 EIA-763

Catalog Datasheet

MFG & Type

PDF

Document Tags

WLCSP flip chip

Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters

Original

PDF

TEA5760

Abstract: PR73002 GH751 PR37156 TEA576x TEA5766 PM 438 BL TEA5766UK EIA 763 EIA-763
Text: TEA5766UK/N1 Product Information Package Author: A.J. v.d. Woude Date: 2006-10-09 Reference Number: RNB-C/2581/2006IX-0217 Version: 1.0 Status: Approved Approver: T. Wang Function: International Product Marketeer Document location: BL-PES Teamroom TEA5766

Original

PDF

TEA5766UK/N1 RNB-C/2581/2006IX-0217 TEA5766 TEA5760 PR73002 GH751 PR37156 TEA576x TEA5766 PM 438 BL TEA5766UK EIA 763 EIA-763