WLFT 404
Abstract: aluminium foil WLFT-405 a 404 R200 Heatsinks 3C-23 C23-C23 WLFT 405
Text: Hola1 H A H Thermally conductive foil both sides adhesive – – – – B good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request C D WLFT WLFT WLFT WLFT E F art. no. 404 R25 404 R50 404 R100
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WLFT 404
aluminium foil
WLFT-405
a 404
R200
Heatsinks
3C-23
C23-C23
WLFT 405
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R200
Abstract: WLFT 404 Al2O3 aluminium foil 200X200 100X100
Text: Hola1 H A H Thermally conductive foil both sides adhesive – – – – B good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request C D WLFT WLFT WLFT WLFT E F art. no. 404 R25 404 R50 404 R100
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WLFT 404
Al2O3
aluminium foil
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Heatsinks
Abstract: WLFT 404 PLCC-28 SMD
Text: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for PLCC B C art. no. ICK R Rth [K/W] [mm] 19 D 12 E art. no. ICK PLCC 28 Rth [K/W] [mm] 25 F 11.8 G art. no. ICK CC 64 Rth [K/W] [mm] 17 17 H surface: black anodised I K L M H H H Thermal conduct. foil WLFT 404/405
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Heatsinks
Abstract: WLFT 404 SK 571 SK571 sk 572 WLFT 405
Text: Hola1 H A H Heatsinks for LEDs B C – suitable for free or forced convection – heat sink dimensions are fitted to the respective LED typ – simple mounting by using thermally conductive adhesive foil, glue or screw mounting – specific versions on customer´s request
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WLFT 404
Abstract: No abstract text available
Text: Hola1 H A H Heatsinks for BGAs B C – particularly suited for Ball Grid Arrays – heatsink dimensions match the respective BGA-type – can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10
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Untitled
Abstract: No abstract text available
Text: Details Heatsinks for LEDs / 23.11.10 08:39 ICK LED R 45,7 x 16,5 G Ø 45,7 x 16,5 mm, for IC design LED Parameters of article ICK LED R 45,7 x 16,5 G R th [K/W] 10.79 dissipation loss [W] 10.8 mounting method therm. conductive foil / therm. cond. adhesive
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ICKLEDR45
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WLFT 404 D
Abstract: Heatsinks
Text: Details Pin heatsinks / 23.11.10 08:59 ICK S R 50 x 10 Ø 50 x 10 mm, pin heatsinks round Parameters of article ICK S R 50 x 10 Bauform Rund R th [K/W] 5.28 dissipation loss [W] 9.5 mounting method therm. conductive foil / therm. cond. adhesive socket universal
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ICKSR50x10_
WLFT 404 D
Heatsinks
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Abstract: No abstract text available
Text: Details Pin heatsinks / 23.11.10 09:00 ICK S R 50 x 20 Ø 50 x 20 mm, pin heatsinks round Parameters of article ICK S R 50 x 20 Bauform Rund R th [K/W] 8.55 dissipation loss [W] 9.8 mounting method therm. conductive foil / therm. cond. adhesive socket universal
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Abstract: No abstract text available
Text: Details Pin heatsinks / 23.11.10 08:50 ICK S 40 x 40 x 20 40 x 40 x 20 mm, pin heatsinks quadratic Parameters of article ICK S 40 x 40 x 20 Bauform Rechteck R th [K/W] 3.5 dissipation loss [W] 21.4 mounting method therm. conductive foil / therm. cond. adhesive
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ICKS40x40x20_
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Heatsinks
Abstract: b14-16 smd 123 25 34 SMD 4 DIL E 6 pin smd ic smd 83 51 a SMD IC smd E6 ART 230
Text: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 6 8 L ICK 14 16 L ICK 20 L D for housings [mm] Rth [K/W] 6/8 contacts 14/16 contacts 20 contacts 8.5 19.0 25.0 83 46 34 for housings [mm] Rth [K/W] E art. no. ICK ICK ICK
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Heatsinks
Abstract: No abstract text available
Text: Hola1 H A H Pin heatsinks art. no. B ICK S 45 x 45 x 20 WLF . 45 x 45 weight: 36 g art. no. C D ICK S 50 x 50 x 20 WLF . 50 x 50 weight: 43 g art. no. E F ICK S 50 x 50 x 25 WLF . 50 x 50 weight: 49 g art. no. G H ICK S 98 x 98 x 45 WLF . 98 x 98 weight: 301.3 g
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WLFT 404
Abstract: ick pga 14x14
Text: Hola1 H A H Heatsinks for PGA B C art. no. D ICK PGA 9 x 9 WLF . 24 x 24 art. no. E F ICK PGA 11 x 11 WLF . 24 x 27 art. no. G H ICK PGA 11 x 11 x 12 WLF . 24 x 27 art. no. I K ICK PGA 14 x 14 WLF . 31 x 34 art. no. L ICK PGA 14 x 14 x 12 WLF . 36 x 36
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pc cooler fan
Abstract: intel 80486 k6-2 500 intel pentium mmx 80486 pentium mmx PENTIUM k6III pentium 200 mmx Pentium MMX MODULE
Text: Hola1 H A H Passive heatsinks for processors B art. no. Rth [K/W] suitable for processor type 6.1 4.5 DEC Alpha-AXP DEC Alpha-AXP ICK A 10 ICK A 20 C dim. [mm] A 10 20 D E art. no. Rth [K/W] suitable for processor type 8.1 Power PC ICK PPC 51 F fixing method:
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15X15
Abstract: Heatsinks 43X43 WLFT 405
Text: Hola1 H A H Heatsinks for PGA art. no. B C ICK PGA 15 x 15 WLF . 37 x 38 art. no. D ICK PGA 16 x 16 x 8 WLF . 40 x 40 art. no. E F ICK PGA 16 x 16 x 12 WLF . 40 x 40 art. no. G H ICK PGA 17 x 17 WLF . 43 x 43 art. no. I K ICK PGA 17 x 17 x 8 WLF . 43 x 43
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Untitled
Abstract: No abstract text available
Text: Hola1 H A H Pin heatsinks art. no. B ICK S 25 x 25 x 12,5 WLF . 25 x 25 weight: 6 g art. no. C D ICK S 25 x 25 x 18,5 WLF . 25 x 25 weight: 7 g art. no. E F ICK S 29 x 29 x 10 WLF . 29 x 29 weight: 11 g art. no. G ICK S 29 x 29 x 20 WLF . 29 x 29 weight: 15 g
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Heatsinks
Abstract: No abstract text available
Text: Hola1 H A H Heatsinks for PGAs and BGAs art. no. B ICK BGA 35 x 35 WLF . 35 x 35 art. no. C D ICK BGA 35 x 35 x 10 WLF . 35 x 35 art. no. E F ICK BGA 40 x 40 WLF . 40 x 40 art. no. G ICK BGA 40 x 40 x 10 WLF . 40 x 40 art. no. H I ICK BGA 42,5 x 45
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Heatsinks
Abstract: No abstract text available
Text: Hola1 H A H Heatsinks for PGA art. no. B C ICK PGA 18 x 18 WLF . 45 x 45 art. no. D ICK PGA 19 x 19 WLF . 19 x 19 art. no. E F ICK PGA 19 x 19 x 12 WLF . 47 x 47 art. no. G H ICK PGA 20 x 20 WLF . 50 x 50 art. no. I K ICK PGA 20 x 20 K WLF . 50 x 50
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Heatsinks
Abstract: 23X23
Text: Hola1 H A H Heatsinks for PGAs and BGAs art. no. B ICK BGA 23 x 23 WLF . 23 x 23 art. no. C D ICK BGA 23 x 23 x 10 WLF . 23 x 23 art. no. E F ICK BGA 27 x 27 WLF . 27 x 27 art. no. G ICK BGA 27 x 27 x 10 WLF . 27 x 27 art. no. H I ICK BGA 31 x 31 WLF . 31 x 31
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14x14
Abstract: No abstract text available
Text: Hola1 H A H Heatsinks for PGAs and BGAs B C – particularly suited for Ball Grid Arrays – heatsink dimensions match the respective BGA-type – can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10
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Untitled
Abstract: No abstract text available
Text: Hola1 H A H Pin heatsinks art. no. B ICK S 14 x 14 x 10 WLF . 14 x 14 weight: 1.9 g art. no. C D ICK S 17 x 17 x 15 WLF . 17 x 17 weight: 4.7 g art. no. E ICK S 17 x 17 x 20 WLF . 17 x 17 weight: 5.6 g art. no. F G ICK S 18 x 18 x 6,5 WLF . 18 x 18
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m 404 g
Abstract: WLFT 405
Text: Hola1 H A H Pin heatsinks art. no. B ICK S 36 x 36 x 10 WLF . 36 x 36 weight: 17 g art. no. C D ICK S 36 x 36 x 15 WLF . 36 x 36 weight: 20 g art. no. E F ICK S 36 x 36 x 20 WLF . 36 x 36 weight: 24 g art. no. G ICK S 40 x 40 x 10 WLF . 40 x 40 weight: 21 g
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smd 404
Abstract: SMD-C10 Heatsinks SMD 26 24 smd 8 pin ic
Text: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for SMD B art. no. ICK SMD C 7 . ICK SMD C 10 . ICK SMD C 17 . Rth [K/W] C [mm] 33 26 17 7 10 17 D art. no. ICK SMD E 15 . ICK SMD E 22 . ICK SMD E 29 . Rth [K/W] [mm] 27 21 18 E 15.3 22.3
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WLFT 404
Abstract: L203 WLFT 405
Text: Thermally conductive foil both sides adhesive - good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request art. WLFT 404 WLFT 404 WLFT 404 WLFT 404 WLFT 414 WLFT 414 no. R25 R50 R100 R200 R25
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WLFT 404
L203
WLFT 405
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sp 571
Abstract: No abstract text available
Text: H eatsin ks for LEDs a rt. no. SK 585 . a rt. no. SK 46 . a rt. no. SK 578 . a rt. no. SK 577 . a rt. no. SK 569 . a rt. no. SK 570 . please indicate: .Mi 10 15 20 25 37.5 50 1000 mm sp e cia l d e sig n , su rface s and m odification to custom er sp ecificatio n on request
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