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    X 13 V Search Results

    X 13 V Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    TPS2300IPW Texas Instruments 3-13V Dual HotSwap IC w/ Independent Channel Circuit Breaking & Power Good Report, Act-Low Enable 20-TSSOP -40 to 85 Visit Texas Instruments Buy
    TPS2310IPW Texas Instruments 3-13V Dual HotSwap IC w/ Inter-dependent Channel Circuit Breaking & Pwr Good Report, Act-Low Enable 20-TSSOP -40 to 85 Visit Texas Instruments Buy
    TPS2320IDR Texas Instruments 3-13V Dual Hot-Swap IC w/ Independent Channel Circuit Breaking, Act-Low Enable 16-SOIC -40 to 85 Visit Texas Instruments Buy
    TPS2321IPW Texas Instruments 3-13V Dual Hot-Swap IC w/ Independent Channel Circuit Breaking, Act-High Enable 16-TSSOP -40 to 85 Visit Texas Instruments Buy
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    X 13 V Price and Stock

    PEPPERL+FUCHS GmbH USI-MH-27X13-V-02

    US-I ULTRASONIC SAFETY BRACKET
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    DigiKey USI-MH-27X13-V-02 Box 1 1
    • 1 $82.67
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    Panduit Corp STP6X13VL

    COPPER PATCH CORD, CAT 6A, VIOLE
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    Avnet Americas STP6X13VL Bulk 8 Weeks 10
    • 1 $33.41
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    Newark STP6X13VL Bulk 10
    • 1 $44.9
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    Sager STP6X13VL 1
    • 1 $45.94
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    • 100 $36.86
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    Panduit Corp UTP28X13VL

    CAT 6A 28AWG UTP PATCH CORD, CM/
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    Newark UTP28X13VL Bulk 10
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    Sager UTP28X13VL 1
    • 1 $39.33
    • 10 $33.86
    • 100 $30.1
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    Panduit Corp UTP6AX13VL

    CABLE MOD 8P8C PLUG TO PLUG 13'
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    DigiKey UTP6AX13VL Bulk 10
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    Avnet Americas UTP6AX13VL Bulk 8 Weeks 10
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    Sager UTP6AX13VL 1
    • 1 $40.13
    • 10 $34.56
    • 100 $30.72
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    Panduit Corp STP6X13VL-Q

    COPPER PATCH CORD, CAT 6A, VIOLE
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    X 13 V Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Low Voltage Supplementary Fuses 13 ⁄32” x 13⁄8” Fast-acting fuses BBS KTQ Specifications Class: Supplemental Description: Fast-acting supplementary fuse. Dimensions: 13⁄32” x 13⁄8” 10.3 x 34.9mm . Construction: Fiber cartridge. Ratings: Volts — 600Vac (1⁄10-5A)


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    600Vac 250Vac 48Vac 2-30A) 0-30A A/600V, E19180, 600Vac) PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5 PDF

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4 PDF

    samsung eMMC 4.5

    Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    spec RG-179

    Abstract: spec RG-178 59 8483 042
    Text: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8


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    PDF

    20 8484 024 001 025

    Abstract: No abstract text available
    Text: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8


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    PDF

    Fuse 250V 2A G20

    Abstract: weidmuller fuse 1.6A fuse 5AF10
    Text: Fuse terminals 10 mm2 KSKM 1 10 mm2 KSKM 2 5 x 20 1 x 1/4 13 x 69 x 63 6.3 / 16 0.33 . 16 13 x 69 x 63 13 / 16 0.33 . 16 TS 32 / PA TS 32 / PA When using ATEX certified components in hazardous area applications the installation instructions and the rated data for


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    20/1A/F 20/2A/F Fuse 250V 2A G20 weidmuller fuse 1.6A fuse 5AF10 PDF

    Untitled

    Abstract: No abstract text available
    Text: Low Voltage Supplementary Fuses 13 ⁄32” x 11⁄2” Time-delay fuses FNQ Specifications Class: Supplemental Description: Time-delay supplementary fuse. Dimensions: 13⁄32” x 11⁄2” 10.3 x 38.1mm . Construction: Fiber tube. Ratings: Volts — 250Vac (or less)


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    250Vac 0-30A 250Vac) 0-15A 125Vac) 32Vac) 2-30A PDF

    FSG-30A

    Abstract: ul 248 fuse 20A FSG-20A FSG-40A FSG-10A 40A fuse automotive Fuse 30A FSG-15A FSG-25A FSG-35A
    Text: Type FSG Automotive Glass Fuse 13/32" x 1-1/2" 10.3 x 38.1mm www.optifuse.com Fuse Size: 13/32” x 1 ½” (10.3 x 38.1mm) Ampere Rating: 500mA ~ 80A Voltage Rating: 32V AC/DC Time Characteristics: 100% Rated Current Min. 500mA – 30A 4h 35A-80A 4h 135%


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    500mA 5A-80A FSG-500mA FSG-10A FSG-15A FSG-20A FSG-25A FSG-30A FSG-35A FSG-30A ul 248 fuse 20A FSG-20A FSG-40A FSG-10A 40A fuse automotive Fuse 30A FSG-15A FSG-25A FSG-35A PDF

    Untitled

    Abstract: No abstract text available
    Text: 2.54 A Male headers soldering technique  0,635 mm, Sandwich B 2,54 3,3 2,8 L S = 6 mm C A 2,8 n x 2,54 2,5 11 S n - 1 x 2,54 0,635 art. no. D 13 13 13 13 13 071 097 122 147 187 . . . . . A 7.10 9.70 12.20 14.70 18.70 art. no. L 21.40 24.00 26.50


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    PDF

    Hynix 128Gb Nand flash

    Abstract: Hynix 64Gb Nand flash nand flash HYNIX MLC 128GB Nand flash hynix Hynix 32Gb Nand flash hynix MLC nand flash 64gb nand flash hynix hynix nand flash 1.8v 4Gb hynix nand flash 4Gb Hynix E NAND
    Text: Last Updated: Nov. 2006 NAND Flash PART NUMBERING HY XX X X XX XX X X - X X (X) (X) (X) (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (13) (12) (1) HYNIX MEMORY (13) OPTION(CUSTOMER) (2) COMPONENT GROUP 27 Customer Initial Option : NAND Flash (12) BAD BLOCK


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    63ball) 107ball) 149ball) Hynix 128Gb Nand flash Hynix 64Gb Nand flash nand flash HYNIX MLC 128GB Nand flash hynix Hynix 32Gb Nand flash hynix MLC nand flash 64gb nand flash hynix hynix nand flash 1.8v 4Gb hynix nand flash 4Gb Hynix E NAND PDF

    MC1495L

    Abstract: No abstract text available
    Text: MC1495L IL00D FOUR-QUADRANT MULTIPLIER —TOP VIEW— RY RX 1 VCC OUT + 2 SCALE Y 3 Y IN (+) 4 VDD 14 OUT (_) 13 SCALE X 12 X IN (_) 9 12 10 RY 11 5 6 4 X IN (+) (+) Y IN (_) SCALE Y SCALE X 3 13 VEE 7 V_ 6 9 X IN (+) 7 VEE 8 Y IN (_) RL VCC (+) (_) 1 OUT


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    MC1495L IL00D MC1495L PDF

    CCD143A

    Abstract: No abstract text available
    Text: Linear Image Sensor Selection Guide CCD Device Maximum Number Pixel Size Pixel Pitch Data Rate of Pixels pm (MHz) 0*m) CCD111 256 13 x 17 13 10.0 CCD112- 256 13 x 17 13 10.0 CCD153A 512 13 x 13 13 20.0 CCD133A 1024 13 x 13 13 20.0 CCD134 1024 13 x 13 13


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    CCD111 CCD123 CCD145 CCD143A CCD181 CCD182 CCD151 CCD191 CCD192 CCD134 CCD143A PDF

    8613 series

    Abstract: u254 MALE CONNECTOR OF 8613 8613 HE-10 connector HE10 he10 SOCKET 26 contacts connector 2.54 MIL-c-83503 50810
    Text: '" - v - 8613 Box headers Dimensions Card drilling 13:X=4.20±0.35 23:X=2.80±0*2 ANGLED SPILL 13 & 23 14 : X = 4.35 ± 0.35 24:X=2.90±0.2 -*•’ *«-2.54 15:X=15.5±0.35 C 17.91 22.99 25.53 30.61 36.23 43.31 48.39 56.01 68.71 81.41 86.49 [B] 10.16 15.24


    OCR Scan
    27-Jt> 3M37Tb6 0G03341 8613 series u254 MALE CONNECTOR OF 8613 8613 HE-10 connector HE10 he10 SOCKET 26 contacts connector 2.54 MIL-c-83503 50810 PDF

    BXY10

    Abstract: BXY13D BXY10C Z6 DIODE BXY13 BXY11 BXY10D BXY11E BXY13C DIODE G06
    Text: B X Y 10 C, 10 D, 11 E, 13 C, 13 D, 14 E Charge storage varactors for frequency multiplication Epitaxial silicon mesa diodes in a ceramic microwave case T yp e B X Y 10 C BXY10D BXY11E BXY13C B X Y 13 D B X Y 14 E T h e rm a l r e s is t a n c e Junction to case


    OCR Scan
    BXY10 BXY10C BXY10D BXY11E BXY13C BXY13 BXY14 Q60223-Y10-C Q60223-Y10-D Q60223-Y11 BXY13D Z6 DIODE BXY11 DIODE G06 PDF

    Untitled

    Abstract: No abstract text available
    Text: IBM0325404 IBM0325804 IBM0325164 IBM03254B4 256Mb Synchronous DRAM - Die Revision A APPLICATION SPEC # 29L0000.E36980 Engineering Change Number 13 ROW /1 1 COL / 2 BS 16Mb x 4 I/O x 4 Bank 13 ROW /1 0 COL / 2 BS (8Mb x 8 I/O x 4 Bank) Date E36980 13 ROW / 9 COL / 2 BS (4Mb x 16 I/O x 4 Bank)


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    IBM0325404 IBM0325804 IBM0325164 IBM03254B4 256Mb 29L0000 E36980 IBM0325404CT3A-260 29L6113 PDF

    CM508

    Abstract: Z0904
    Text: X Kontaktanordnung contact I 32 E i n l ö t - K o n t a k t e 32 s o l d e r - c o n t a c t s arrangement 32 28 30 24 26 20 22 16 18 12 U 8 10 6 2 13 13 13 13 13 13 13 13 13 13 13 13 13 13 H o o B 1 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 ? Bl solder-contac t


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: X Kontaktanordnung contact Z 2: 1 32 E in l ö t - K o n t a k t e 32 s o l d e r - c o n t a c t s arrangement 32 28 30 24 26 20 22 16 18 12 U 8 10 4 6 2 Bl solder-contac t _ a 13 13 13 13 13 13 13 13 13 13 13 13 13 13 H o o B 1 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 ?


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: 5 X K o n t a k t a n o r d n u n g / contact arrangement 15 Kontakte 15 contacts 32 28 24 20 16 12 8 4 I 30 | 26 | 22 | 18 | U | 10 | 6 | IX I IX I X I X X I X X IX I ^1IX 13^ X 13^1 X I 13 X L ochbi I d / board drillings 32 I 7x 10,16 4 4 — d I (=71,12)


    OCR Scan
    D-32339 PDF

    W2G115-AE31-01

    Abstract: W2G115-AD15-01 W2G115-AD17-13 W2G115-AE31-13 W2G115-ae53-13 LR431 E54522 W2G115-AD17-01
    Text: W2G 115 B ru shle ss DC ebmw INDUSTRIES 5" X 1 -7 / I NC 127mm x 38mm A ir Performance AllrtOW CODC fT4l|lPS.TX)>^ Airflow CFM Ball Bearing Max. Temp. 72 C DC Volts Watts CFM dBA W2G115AE53-13 W2G115-AE53-01 W2G115-AE31-13 W2G115-AE31-01 W2G115-AD15 13 W2G115-AD15-01


    OCR Scan
    127mm 1133mm 1177mm W2G115AE53-13 W2G115-AE53-01 W2G115-AE31-13 W2G115-AE31-01 W2G115-AD15-13 W2G115-AD15-01 W2G115-AD17-13 W2G115-ae53-13 LR431 E54522 W2G115-AD17-01 PDF