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    X-FAB TEXAS Search Results

    X-FAB TEXAS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54HC158/BEA Rochester Electronics LLC Replacement for Texas Instruments part number 5962-8682301EA. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    74167N Rochester Electronics Replacement for Texas Instruments part number SN74167N. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics Buy
    74LS626N Rochester Electronics LLC Replacement for Texas Instruments part number SN74LS626N. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    54184J/B Rochester Electronics LLC Replacement for Texas Instruments part number SNJ54184J. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    54ALS113AJ/B Rochester Electronics LLC Replacement for Texas Instruments part number SNJ54ALS113AJ. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy

    X-FAB TEXAS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    74LS04D

    Abstract: mitsubishi lot code HBM 00-01 74ls04d datasheet TI Ji Bipolar LINEAR TECHNOLOGY date code JI Bipolar 500 mold compound JI Linear Bipolar Products TL 170C
    Text: TEXAS INSTRUMENTS Final Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab July 22, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) has qualified Mitsubishi


    Original     		PDF 125mm 85C85 260deg 74LS04D mitsubishi lot code HBM 00-01 74ls04d datasheet TI Ji Bipolar LINEAR TECHNOLOGY date code JI Bipolar 500 mold compound JI Linear Bipolar Products TL 170C

    F741583

    Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
    Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001


    Original     		PDF EN-4085S2K3 96mils L3/260C UL94-V0 TMS471R1F138 85C/85 3/260C F741583 sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV

    TMS57002DPHA

    Abstract: TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993
    Text: Texas Instruments Incorporated Transfer the Assembly Production for the TMS57002DPHA Device from HIJI to TIPI and the Transfer the Wafer Fab Source from MIHO5 to HFAB SAMPLE REQUEST / FINAL NOTIFICATION LETTER PCN# 20020411001 May 28, 2002 Dear Customer: The following notes apply to this correspondence:


    Original     		PDF TMS57002DPHA TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993

    shinetsu

    Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
    Text: TEXAS INSTRUMENTS Final Notification for the Qualification of Shinetsu KMC-288 Mold Compound at the Hiji, Malaysia, and Mexico Assembly/Test Facilities May 19, 1998 Abstract Texas Instruments, Mixed Signal and Logic group, is qualifying Shinetsu KMC-288 mold


    Original     		PDF KMC-288 KMC-288 KMC-166 SN74ACT16241DGG JESD22 KMC-166 SN74ACT16841DGG SN74ABT16823DGV shinetsu KMC288 SLL-28 EN-4088Z TEXAS INSTRUMENTS, Mold EPIC-1S

    50B40

    Abstract: EN-4088Z KMC-166 SN74GTL16612 SN74GTL16612A SN74GTL16616 TEXAS INSTRUMENTS, Mold Compound ASL2B mold compound
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74GTL16612A GTL/GTL+ B-Port Output Edge Control Circuits Optimized for Distributed Load Applications August 27, 1999 Abstract Texas Instruments has qualified the SN74GTL16612A redesign of the SN74GTL16612


    Original     		PDF SN74GTL16612A SN74GTL16612 SN74GTL16612 95MHz. 85MHz. GTL16612 GTL16612A 50B40 EN-4088Z KMC-166 SN74GTL16616 TEXAS INSTRUMENTS, Mold Compound ASL2B mold compound

    10KACN

    Abstract: LVC112A EN-4088Z SN74LVC112AD
    Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of SOIC Narrow Body D and SSOP (DL) in all pin variations to TI Mexico Assembly/Test Facility (TMX) December 3, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the SOIC and


    Original     		PDF SN74ABT16823DL 5297B 10KACN LVC112A EN-4088Z SN74LVC112AD

    ABT16245A

    Abstract: 8041016 EN-4088Z texas instruments lot trace code SN74ABT16245 dimensions 4088 sn74abt EN4088Z SN74ABT162244 SN74ABT162245
    Text: TEXAS INSTRUMENTS Qualification Notification for Selected SN74ABT/ABTH Device Redesigns December 14, 1998 Abstract Texas Instruments Standard Linear and Logic is issuing this notification to qualify the redesign of four devices in the ABT technology. These devices were redesigned for a die shrink


    Original     		PDF SN74ABT/ABTH 62245DL ABTH16245DL ABTH162245DL ABT16245A 8041016 EN-4088Z texas instruments lot trace code SN74ABT16245 dimensions 4088 sn74abt EN4088Z SN74ABT162244 SN74ABT162245

    SHINKO

    Abstract: KMC-166 EN-4065 EN-4088Z 50B40
    Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of TVSOP and TSSOP in all pin variations to TI Mexico Assembly/Test Facility TMX September 5, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the TVSOP and


    Original     		PDF TMLVCH162830DBB SN74ALVCH162830DBB SHINKO KMC-166 EN-4065 EN-4088Z 50B40

    EPIC-1ZS

    Abstract: 50C24 50C24.1 SN74CBT16244 SN74CBT3125 SN74CBT3126 SN74CBT3306 SN74CBT6800 SN74CBT6800A SN74CBTD3306
    Text: TEXAS INSTRUMENTS Qualification Notification for Select ’SN74CBT’ Technology Devices August 12,1999 Abstract Texas Instruments has qualified die revisions and die shrinks for several device types in the SN74CBT technology family. These devices were redesigned in order to optimize yields and increase capacity. This


    Original     		PDF SN74CBT' SN74CBT CBT6800 CBT6800A 74CBT6800 74CBT6800 74CBT6800A EPIC-1ZS 50C24 50C24.1 SN74CBT16244 SN74CBT3125 SN74CBT3126 SN74CBT3306 SN74CBT6800 SN74CBT6800A SN74CBTD3306

    CD4000

    Abstract: CD4011BE harris sec 743 CD4013BE CD4020BE Datasheet CD4060BE CD4067BE CD40106BE CD40110BE CD4011BE
    Text: TEXAS INSTRUMENTS Final Notification of the CD4K-H Process Qualification for Acquisition of Harris Semiconductor CD4000 Logic Business May 10, 1999 Abstract Texas Instruments Standard Linear and Logic Products SLL is pleased to announce the successful completion of the CD4K-H process qualification for the CD4000 products acquired from Harris


    Original     		PDF CD4000 CD4514BE CD4070BM CD4000 CD4514BM CD4071BE CD4515BE CD4071BER3812 CD4011BE harris sec 743 CD4013BE CD4020BE Datasheet CD4060BE CD4067BE CD40106BE CD40110BE CD4011BE

    TL062p

    Abstract: TL084IDR TL084ACDR TL082BCDR TL082BCP TL084ACD TL082ACP TL082BCD TL084IN TL084BCD
    Text: TEXAS INSTRUMENTS Notification of the Excalibur-1 Process in SFAB October 7, 1997 Abstract Texas Instruments Standard Linear and Logic has completed qualification for wafer sourcing of Excalibur-1 Process in the Sherman Wafer Fabrication site SFAB in Sherman, Texas. Reference


    Original     		PDF TL072IP3 TL074ACJ TL074BCDR TL074IDR10 TL081ACDR TL081BCDR TL081CDR10 TL081ID TL082ACD TL082ACP TL062p TL084IDR TL084ACDR TL082BCDR TL082BCP TL084ACD TL082ACP TL082BCD TL084IN TL084BCD

    PC2400

    Abstract: QMI-505MT QMI505 5310A EN-4088Z QMI505MT SN74F32 SN74F32N RH42
    Text: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for PDIP Product March 18, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount compound


    Original     		PDF 505MT EN-4088Z QMI-505MT PC2400 QMI505 5310A QMI505MT SN74F32 SN74F32N RH42

    transistor MN1

    Abstract: NAND Qualification Reliability HC00D SN74HC00 texas instruments lot trace code EN-4088Z HC00 HCT00 SN74HCT00 S01-06800
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74HC00 and SN74HCT00, Die Revision K August 20, 1997 Abstract Texas Instruments qualified the SN74HC00 and SN74HCT00 die revision K, to replace the SN74HC00 die revision F and the SN74HCT00 die revision G. Die revision K is a product


    Original     		PDF SN74HC00 SN74HCT00, SN74HCT00 S01-06800 transistor MN1 NAND Qualification Reliability HC00D texas instruments lot trace code EN-4088Z HC00 HCT00

    LT1013CP

    Abstract: LT1013
    Text: TEXAS INSTRUMENTS Informational Notification for the Qualification of LT1013 Die Revision H September 30, 1998 Abstract Texas Instruments Inc., Standard Linear and Logic products SLL has completed a redesign/shrink of the LT1013 device. This device is manufactured in the Sherman Wafer Fab (SFAB) using qualified JI


    Original     		PDF LT1013 LT1013 QTS-10436 LT1013CP

    TL431CLP

    Abstract: plaskon on 5295 transistor LMISR4 Texas Instruments Philippines 2374A TL431 2374ab Linear Technology PCN TO 92 leadframe
    Text: TEXAS INSTRUMENTS Final Notification for TO-92 Package to be Built at PSI Technologies, Inc. in Manila, Philippines June 3, 1997 Abstract As previously notified in April by PCN 5295, Texas Instruments Standard Linear and Logic Products SLL has qualified the PSI Technologies, Inc. subcontractor plant in the Philippines to


    Original     		PDF TL431CLP TL431CLP plaskon on 5295 transistor LMISR4 Texas Instruments Philippines 2374A TL431 2374ab Linear Technology PCN TO 92 leadframe

    LM393P

    Abstract: TI Ji Bipolar leadframe JI Bipolar 01003 LM393 TS-095 16 PIN PDIP TEXAS INSTRUMENTS
    Text: TEXAS INSTRUMENTS Informational Notification for the Qualification of the 8 Pin IDLF Leadframe July 31, 1998 Abstract Texas Instruments Inc., Standard Linear and Logic products SLL is converting from the conventionally designed 8 pin PDIP leadframe to the interdigitated leadframe (IDLF) design for the TI


    Original     		PDF LM393P LM393P TI Ji Bipolar leadframe JI Bipolar 01003 LM393 TS-095 16 PIN PDIP TEXAS INSTRUMENTS

    SN74CBT16233

    Abstract: eiaj datecode relco CBT16233 EN-4088Z SN74CBT16233DL ASL2B
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16233, Die Revision B October 29, 1998 Abstract Texas Instruments has qualified a die revision for the CBT16233, die revision ‘B’. This device was redesigned in order to incorporate improved ESD protection circuitry.


    Original     		PDF SN74CBT16233, CBT16233, SN74CBT16233 eiaj datecode relco CBT16233 EN-4088Z SN74CBT16233DL ASL2B

    tanaka gold wire

    Abstract: tanaka wire tanaka bonding wire tanaka GPG wire tanaka wire 15 mils tanaka EN-4088Z SN74LS244 SN74LS244DW
    Text: TEXAS INSTRUMENTS Qualification Notification of the Change from 0.95 mil Conventional Gold Bonding Wire to 0.80 mil Tanaka GPG Gold Alloy Bonding Wire for SLL Product June 23, 1997 Abstract Texas Instruments Standard Linear and Logic Products SLL has qualified the 0.80 mil Tanaka GPG


    Original     		PDF S01-06486 S01-06563 tanaka gold wire tanaka wire tanaka bonding wire tanaka GPG wire tanaka wire 15 mils tanaka EN-4088Z SN74LS244 SN74LS244DW

    Precon

    Abstract: 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S
    Text: TEXAS INSTRUMENTS Final Notification for the 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab February 19, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB has completed the qualification to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication


    Original     		PDF 150mm 125mm DiH20Rn 260deg Precon 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S

    JI Bipolar

    Abstract: 5331a
    Text: TEXAS INSTRUMENTS Final Notification for 2 Pin KTP Package to be Built at PSI Technologies, Inc. in Manila, Philippines September 15, 1998 Abstract Texas Instruments Inc, Standard Linear and Logic Products SLL has completed qualification of PSI Technologies, Inc. subcontractor site in Manila, Philippines to build the 2 pin


    Original     		PDF

    TL783CKC

    Abstract: QTS06450
    Text: TEXAS INSTRUMENTS Final Notification for the Addition of BIDFET Process to the Sherman Wafer Fabrication Site and Die Revision for TL783CIN July 27, 1998 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the BIDFET process. The


    Original     		PDF TL783CIN TL783CIN QTS06450 TL783CKC

    PMC-90

    Abstract: PMC-90 leadframe material MP150SG pmc90 MP150s poongsan pmc 26 mold compound "leadframe material" DIP 20 plaskon poongsan pmc
    Text: TEXAS INSTRUMENTS Final Notification of New Mold Compound for TO-220 Packages; New Source for Leadframes and Au Wire May 7, 1998 Abstract Texas Instruments has qualified a new mold compound for the TO-220 packages. This new compound will be used in addition to the previously qualified compounds, and add flexibility to our


    Original     		PDF O-220 UA7808CKC, PMC-90 PMC-90 leadframe material MP150SG pmc90 MP150s poongsan pmc 26 mold compound "leadframe material" DIP 20 plaskon poongsan pmc

    CBT16211A

    Abstract: EPIC-1ZS EN-4088Z SN74CBT16209 SN74CBT16210 SN74CBT16211 SN74CBT16211A SN74CBT16211DL
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16211A, Die Revision D September 16, 1997 Abstract Texas Instruments has qualified a device revision for the SN74CBT16211A, die revision ‘D’ to replace the SN74CBT16211, die revision ‘B’. This device was redesigned in order to improve the ESD


    Original     		PDF SN74CBT16211A, SN74CBT16211, SN74CBT16211 SN74CBT16211A CBT16211A, CBT16211, CBT16211 CBT16211A CBT16211A EPIC-1ZS EN-4088Z SN74CBT16209 SN74CBT16210 SN74CBT16211DL

    SN75LP185A

    Abstract: EN-4088Z SN75LPE185 SN75LPE185DW
    Text: TEXAS INSTRUMENTS Final Notification for the SN75LP185A/SN75LPE185 Devices May 22, 1998 Abstract Texas Instruments has redesigned the SN75LP185 and SN75LPE185 to remove waivers currently associated with these devices. A data sheet change will occur on the SN75LP185 so it will be called the


    Original     		PDF SN75LP185A/SN75LPE185 SN75LP185 SN75LPE185 SN75LP185A. SN75LP185A SN75LP185A, SN75LP185, EN-4088Z SN75LPE185DW