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    XILINX MECHANICAL DRAWINGS Search Results

    XILINX MECHANICAL DRAWINGS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    VERSALDEMO1Z Renesas Electronics Corporation Xilinx Versal ACAP Demonstration Board Visit Renesas Electronics Corporation
    R7F701412EABG Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701428EABG Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701404EAFB Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701442EAFB Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation

    XILINX MECHANICAL DRAWINGS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    INCOMING RAW MATERIAL INSPECTION checklist

    Abstract: INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION report format HPC 3022 INCOMING RAW MATERIAL INSPECTION procedure internal audit checklist raw material inventory forms ISO calibration certificate formats QCP0010 pressure gauge ISO calibration certificate format
    Text: ZONE REV .XX Unless otherwise specified, dimensions are in inches. DRAWN APP’VD DATE Initial Release per DCN 1570 05/03/90 02 Change per DCN 1680 05/22/90 JFC SA 02a S/W App Conversion per DCN 4004 01/13/93 KB RT 03 Change per DCN 4925 12/29/93 YN FM 04


    Original     		MAC0071 MAC0072) QAP0002 INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION report format HPC 3022 INCOMING RAW MATERIAL INSPECTION procedure internal audit checklist raw material inventory forms ISO calibration certificate formats QCP0010 pressure gauge ISO calibration certificate format PDF

    Untitled

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		Q1-02 PDF

    ML505

    Abstract: ML507 XPS IIC ML506 JTAG Xilinx lcd ML506 VIRTEX-5 DDR2 pcb design sata2 design guide VIRTEX-5 DDR PHY ML50x
    Text: ML505/ML506/ML507 ML505/ML506/M L507 Reference Reference Design Design User Guide [optional] UG349 v3.0.1 June 27, 2008 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development


    Original     		ML505/ML506/ML507 ML505/ML506/M UG349 DS572, XAPP778, DS481, DS484, DS575, UG081, DS614, ML505 ML507 XPS IIC ML506 JTAG Xilinx lcd ML506 VIRTEX-5 DDR2 pcb design sata2 design guide VIRTEX-5 DDR PHY ML50x PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    XC6VLX240T-1FFG1156

    Abstract: virtex-6 ML605 user guide example ml605 FMC 150 example ml605 ML605 ML605 DVI ml605 bom xilinx DDR3 controller user interface UG533 ddr3 ram repair
    Text: Getting Started with the Xilinx Virtex-6 FPGA ML605 Evaluation Kit [Guide Subtitle] [optional] UG533 v1.4 November 15, 2010 [optional] XPN 0402771-01 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development


    Original     		ML605 UG533 DS715, com/products/boards/ml605/reference XC6VLX240T-1FFG1156 virtex-6 ML605 user guide example ml605 FMC 150 example ml605 ML605 DVI ml605 bom xilinx DDR3 controller user interface UG533 ddr3 ram repair PDF

    JS28F256P30

    Abstract: FF324 ACE FLASH FF1153 FF1760 N4078 System ACE CompactFlash Solution FF676 UG222 XCF32P
    Text: Virtex-5 LX FPGA Prototype Platform User Guide UG222 v1.1 April 18, 2008 R P/N 0402510-02 R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG222 DS123, UG191, UG196, DS100, DS202, UG190, UG193, UG192, JS28F256P30 FF324 ACE FLASH FF1153 FF1760 N4078 System ACE CompactFlash Solution FF676 UG222 XCF32P PDF

    Untitled

    Abstract: No abstract text available
    Text: ML52x User Guide Virtex-5 FPGA RocketIO Characterization Platform UG225 v2.1 August 4, 2010 R 0402527-03 R Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development


    Original     		ML52x UG225 DS080, UG091, UG190, UG196, UG198, PDF

    J132 regulator

    Abstract: ML525 VIRTEX-5 DDR2 pcb design J135 ff1136 ML523 am2 SOCKET PIN LAYOUT diode ak38 e48 connector ESD Pushbutton data sheet
    Text: ML52x User Guide Virtex-5 FPGA RocketIO Characterization Platform UG225 v2.0 April 17, 2008 R 0402527-03 R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		ML52x UG225 DS080, UG091, UG190, UG196, UG198, J132 regulator ML525 VIRTEX-5 DDR2 pcb design J135 ff1136 ML523 am2 SOCKET PIN LAYOUT diode ak38 e48 connector ESD Pushbutton data sheet PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF

    Tianma TM162VBA6

    Abstract: TM162VBA6 JS28F256P30T95 Virtex-5 XC5VLX50-1FFG676 FPGA AD1981 Codec Marvell 88E1111 trace layout guidelines 16P101-40M L4 IS61NLP25636A-200TQL ROSENBERGER 16p101-40m Xilinx jtag cable pcb Schematic
    Text: ML501 Evaluation Platform User Guide UG226 v1.4 August 24, 2009 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		ML501 UG226 UG228, UG227, WP260, UG086, Tianma TM162VBA6 TM162VBA6 JS28F256P30T95 Virtex-5 XC5VLX50-1FFG676 FPGA AD1981 Codec Marvell 88E1111 trace layout guidelines 16P101-40M L4 IS61NLP25636A-200TQL ROSENBERGER 16p101-40m Xilinx jtag cable pcb Schematic PDF

    X74-168

    Abstract: ieee vhdl projects free 5000-Series 8 BIT ALU design with vhdl code using structural ABEL-HDL Reference Manual XC4000 XC4000E XILINX/x74_194
    Text: Xilinx XCFPGA Interface Kit Manual May 1997 Synario Design Automation, a division of Data I/O, has made every attempt to ensure that the information in this document is accurate and complete. Synario Design Automation assumes no liability for errors, or for any incidental,


    Original     		97lobal X74-168 ieee vhdl projects free 5000-Series 8 BIT ALU design with vhdl code using structural ABEL-HDL Reference Manual XC4000 XC4000E XILINX/x74_194 PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    Untitled

    Abstract: No abstract text available
    Text: n Military Logic CeN Arrays XC2018B, XC3020B, XC3042B, XC3090B Product Specifications INTRODUCTION Xilinx introduced the first field programmable gate array FPGA in 1985. The development of the PGA was the result of a number of technical breakthroughs and truly


    OCR Scan     		XC2018B, XC3020B, XC3042B, XC3090B PDF

    CPGA

    Abstract: 144 CERAMIC PIN GRID ARRAY CPGA Xilinx XC3090 FPGA 144 CPGA ASIC standard military device CPGA132 MO-082
    Text: K Military Logic Cell Arrays XC2018B, XC3020B, XC3042B, XC3090B Product Specifications INTRODUCTION Device Xilinx introduced the first field programmable gate array FPGA in 1985. The development of the PGA was the result of a number of technical breakthroughs and truly


    OCR Scan     		XC2018B, XC3020B, XC3042B, XC3090B MIL-STD-883 2010/B 1010/C 2001/E CPGA 144 CERAMIC PIN GRID ARRAY CPGA Xilinx XC3090 FPGA 144 CPGA ASIC standard military device CPGA132 MO-082 PDF