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    XILINX PACKAGE DIMENSIONS PLCC 44 PIN Search Results

    XILINX PACKAGE DIMENSIONS PLCC 44 PIN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    XILINX PACKAGE DIMENSIONS PLCC 44 PIN Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 PDF

    Untitled

    Abstract: No abstract text available
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead 44-contained PDF

    diode 3039c

    Abstract: AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead 44-tained XC3000 diode 3039c AT17F040 AT17F080 AT24CXXX ATDH2200E XC4000 XC5200 PDF

    3039B

    Abstract: AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead 44-contained 3039B AT17F040 AT17F080 AT24CXXX ATDH2200E XC3000 XC4000 XC5200 PDF

    3039G

    Abstract: AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC4000 XC5200 3039G AT17F040 AT17F080 AT24CXXX XC3000 PDF

    AT17F040

    Abstract: AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC4000 XC5200 AT17F040 AT17F080 AT24CXXX XC3000 PDF

    AT17F040

    Abstract: AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC3000TM XC4000TM XC5200 AT17F040 AT17F080 AT24CXXX XC3000 XC4000 PDF

    AT17F040

    Abstract: AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead XC3000TM XC4000TM AT17F040 AT17F080 AT24CXXX ATDH2200E XC3000 XC4000 XC5200 PDF

    AT17F040-30CI

    Abstract: 0444A AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC3000 XC4000 XC5200 AT17F040-30CI 0444A AT17F040 AT17F080 AT24CXXX PDF

    footprint jedec MS-026 TQFP

    Abstract: AT17F16 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC3000 XC4000 XC5200 footprint jedec MS-026 TQFP AT17F16 AT24CXXX PDF

    AT17F16

    Abstract: AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC3000 XC4000 XC5200 AT17F16 AT24CXXX PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    atmel 042

    Abstract: J-Lead, plcc Package TYPE ATMEL AT17 AT17C002 AT17LV002 AT24CXXX AT40K AT94K XC3000
    Text: Features • EE Reprogrammable 2,097,152 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • In-System Programmable via 2-wire Bus • Simple Interface to SRAM FPGAs • Compatible with Atmel AT6000, AT40K and AT94K Devices, Altera FLEX , APEX


    Original     		AT6000, AT40K AT94K XC3000TM, XC4000TM, XC5200TM, 20-lead 44-lead atmel 042 J-Lead, plcc Package TYPE ATMEL AT17 AT17C002 AT17LV002 AT24CXXX XC3000 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    Untitled

    Abstract: No abstract text available
    Text: Features • EE Reprogrammable 4,194,304 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • In-System Programmable via 2-wire Bus • Simple Interface to SRAM FPGAs • Compatible with Atmel AT6000, AT40K and AT94K Devices, Altera FLEX , APEX


    Original     		AT6000, AT40K AT94K XC3000TM, XC4000TM, XC5200TM, 44-lead AT24CXXX PDF

    Untitled

    Abstract: No abstract text available
    Text: £ X IL IN X XC7354 54-Macrocell CMOS EPLD Preliminary Product Specifications Features • High-Performance EPLD - 10 ns pin-to-pin delay - 100 MHz maximum clock frequency • Advanced Dual-Block architecture - Two Fast Function Blocks - Four High-Density Function Blocks


    OCR Scan     		XC7354 54-Macrocell 18-bit 68-Pin XC7354 PG144 PQ160 PB22S WB225 PDF

    Untitled

    Abstract: No abstract text available
    Text: f l XC7354 54-Macrocell CMOS EPLD X IL IN X Preliminary Product Specifications Features • High-Performance EPLD - 10 ns pin-to-pin delay - 100 MHz maximum clock frequency • Advanced Dual-Block architecture - Two Fast Function Blocks - Four High-Density Function Blocks


    OCR Scan     		XC7354 54-Macrocell 18-bit 68-pin PQ160 XC7354 PG144 PG184 BG225 PDF

    Untitled

    Abstract: No abstract text available
    Text: XC7372 72 Macrocell CMOS EPLD HXILINX Advance Product Information The Universal Interconnect Matrix connects the Function Blocks to each other and to all input pins, providing 100% connectivity between the Function Blocks. This allows logic functions to be mapped into the Function Blocks and


    OCR Scan     		XC7372 XC7372 68-Pin 84-Pin PDF

    Untitled

    Abstract: No abstract text available
    Text: XC7354 54-Macrocell CMOS EPLD £ XILINX Product Specifications The Universal Interconnect Matrix connects the Function Blocks to each other and to all input pins, providing 100% connectivity between the Function Blocks. This allows logic functions to be mapped into the Function Blocks and


    OCR Scan     		XC7354 54-Macrocell XC7354 XC7300 68-Pin PQ100 PG144 PQ160 BG225 PDF