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    XMC2-1232 Search Results

    XMC2-1232 Result Highlights (5)

    Part
    ECAD Model
    Manufacturer
    Description
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    77317-812-32LF
    3D Model
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 32 Positions ,2.54mm (0.100in) Pitch, PDF
    77317-112-32LF
    3D Model
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 32 Positions ,2.54mm (0.100in) Pitch, PDF
    54122-812322050LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch PDF
    10136647-031232LF
    3D Model
    Amphenol Communications Solutions Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 3 Positions, GW Compatible, without Posts, Tray packing. PDF
    10137785-051232LF
    Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 5 Positions, GW Compatible, without Post, Tray packing. PDF