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Catalog Datasheet	MFG & Type	PDF	Document Tags
Y1006X5R1C104M Abstract: ic packages Text: Wire-bonding Capacitors Y16,Y10 series •Features ・Decoupling capacitors for IC chips. ・Applicable to be mounted inside IC packages due to their extremely thin structures. ・Available to be mounted by wire-bonding with Au plating terminals. ・available in a high temperature area up to 125℃.	Original	PDF	Y1606X7R1E104M Y1006X5R1C104M 16Vdc 100nF 100nF( Y1006X5R1C104M ic packages

Catalog Datasheet

MFG & Type

PDF

Document Tags

Y1006X5R1C104M

Abstract: ic packages
Text: Wire-bonding Capacitors Y16,Y10 series •Features ・Decoupling capacitors for IC chips. ・Applicable to be mounted inside IC packages due to their extremely thin structures. ・Available to be mounted by wire-bonding with Au plating terminals. ・available in a high temperature area up to 125℃.

Original

PDF

Y1606X7R1E104M Y1006X5R1C104M 16Vdc 100nF 100nF( Y1006X5R1C104M ic packages