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    YAMAICHI IC 120 TEST SOCKET Search Results

    YAMAICHI IC 120 TEST SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    YAMAICHI IC 120 TEST SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    lcd pm 128 bl

    Abstract: FPS009-2700-0 Yamaichi Electronics ic197 FMS006-2600-0 IC149 CN048S-1002-0 socket Yamaichi IC149 - 064 FLS007-3003-0 ICP-064-2 FPS009-230
    Text: IC149 Series | YAMAICHI ELECTRONICS Skip the Header Menu and the body text, and get to the Main Menu. Skip the Header Menu and get to the body text. Japanese | Our Worldwide Sites Search Skip the body text and get to the Main Menu. QFP 1 of 11 6/23/2005 2:02:35 PM


    Original     		PDF IC149 p/products/connector/icsocket/ic149/ic149 lcd pm 128 bl FPS009-2700-0 Yamaichi Electronics ic197 FMS006-2600-0 CN048S-1002-0 socket Yamaichi IC149 - 064 FLS007-3003-0 ICP-064-2 FPS009-230

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION


    Original     		PDF MIL-M-38510 MIL-STD-883 Yamaichi ic354 IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


    Original     		PDF 10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48

    ICP-080-6

    Abstract: IC149 ICP-160-1 ICP-044-2 ICP-064-2 ICP-080-4 ICP-080-7
    Text: Yamaichi's IC149 Series QFP Production Socket Insulator High Temperature Thermoplastic UL94V-0 Rated Contact Copper Alloy Plating Solder or gold plate over nickel Insulation Resistance Refer to chart below Breakdown Voltage Refer to chart below Contact Resistance


    Original     		PDF IC149 UL94V-0 IC149-044- 500Mohms ICP-044-4 IC149-256K12624-S0 IC149-256K12624-S1 ICP-080-6 ICP-160-1 ICP-044-2 ICP-064-2 ICP-080-4 ICP-080-7

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		PDF March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311

    ic59-64075-G4

    Abstract: IC51-0242-802 PC4600 ic59-64075 Eletech Electronics f 4556 IC51-0844-401-1 QFP 128 lead .5mm M32182 M32R
    Text: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of


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    740-Family

    Abstract: 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798
    Text: Introduction To meet the needs for target systems that vary from customer to customer, Mitsubishi provides a wide selection of MCU packages and various types of accessories. These accessories can be used to connect the target and emulator, as well as mount an evaluation MCU on the target when its package is different from that of the actual


    Original     		PDF 64-pin, 80-pin, 100pin PCA7754 PCA7755A PCA7755B PCA7756 SEAL100FP SEAL64FP SEAL80FP 740-Family 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798

    MSP430 pin diagram

    Abstract: 68CLCC pin diagram of MSP430 MSP-PRG430A IEE1149 IC51-0644-807 DIODE c336 MSP430C311SDL MSP430C313DL MSP430P313DL
    Text: MSP430 Family Accessing MSP430 Hardware, accessing MSP430 in-system and MSP430 device Topic 1 1.1 1.2 1.3 1.3 1.5 1.6 1.7 1.8 2 2.1 2.2 2.3 2.4 Page Basic Hints 1-3 TI’s Programming Adapter - Target connector signals 1-3 Configuration of TMS, TCK, TDI/VPP and TDO/TDI pins in applications


    Original     		PDF MSP430 MSP430 MSP-PRG430A MSP-PRG430B MSP-PRG430A MSP430C313DL, MSP430P313DL MSP430C311SDL MSP430 pin diagram 68CLCC pin diagram of MSP430 IEE1149 IC51-0644-807 DIODE c336 MSP430C311SDL MSP430C313DL MSP430P313DL

    solder paste alpha WS609

    Abstract: WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 MO-193
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


    Original     		PDF SCBA009A MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF solder paste alpha WS609 WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000

    Alpha WS609

    Abstract: solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A The Thin Very Small Outline Package (TVSOP) Acknowledgment The authors wish to acknowledge the following persons and corporations for their invaluable assistance in the preparation of this document.


    Original     		PDF SCBA009A IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF IC51-0142-2074 Alpha WS609 solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000

    Alpha WS609

    Abstract: Yamaichi TQFP 244 MO-194AA MO-193 MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx
    Text: TVSOP Application Brief December 1996 SCBA009B List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Draft 1.3 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


    Original     		PDF SCBA009B MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF Alpha WS609 Yamaichi TQFP 244 MO-194AA MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx

    Untitled

    Abstract: No abstract text available
    Text: IC 275 Series IC275-16S 05 •i.-"'rr — Socket Series No. of Leads 3— 1 Design N o | j^raderisti^ Insulation Resistance: Withstanding Voltage: 1,OOOMQminimum at 700 VDC Contact Resistance: 700 VAC for 1 Minute 2mQ or less at 10mA/20mV (Initial) Operating Temperature:


    OCR Scan     		PDF IC275-16S 10mA/20mV

    Untitled

    Abstract: No abstract text available
    Text: PR51 Series CiwarterlsBcs Insulation Resistance: Contact Resistance: <100MQ 10MQ at 500 VD C Operating Temperature: -40'C - +140'C (Material) Base Material: Contact: Natural or Black Ultem Fully Hardened BeCu Plating: Gold over Nickel (Description} Socket test probes are used in conjunction with your board tester to ensure reliability of your bum-in or test board prior


    OCR Scan     		PDF 100MQ

    IC26-0803-GG4

    Abstract: MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5
    Text: YAMAICHI ELECTRONICS Production 1C Sockets IC26 S /y - X SIP IC 140$/'J-X (DIP) IC26Series(SIP) IC140Series(DIP) ►P02 1 I »-P09' IC30 î / ' J - X (SIP) IC1602/U—X(PLCC) IC30Series(SIP) IC160 Series(PLCC) IC140 $ /'J -X (SIP) IC 149S/U -X (QFP) IC140Series(SIP)


    OCR Scan     		PDF IC26Series IC140Series IC30Series IC140Ã IC160 IC149S/U-X IC149 IC26S/ IC26-0803-GG4 MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5

    54B5

    Abstract: ICP-144-1 ICP-044-2 61B5 IC148 05-B5 ctvps qfp 100 SOCKET
    Text: IC149 Series QFP 0.4~1.OmmPitch (@e£CTTONIC5^ Features h m ñ r m u ^ Q F P i M i c y 'r 7 k z h t c s v j ic t m - 7 'y ^ J W - x D t c t b s s z m m a m t t o (ICP) b z r 'C y f 'y ? QFP-test socket developed using Yamaichi Electronics expertise in Test & Burn-in IC socket production


    OCR Scan     		PDF IC149 30mQOT IC149-100- 14-B5 28-B5 C149-208- 61-B5* IC149-176- 66-B5* 54B5 ICP-144-1 ICP-044-2 61B5 IC148 05-B5 ctvps qfp 100 SOCKET

    IC51-1444-1354

    Abstract: No abstract text available
    Text: YA MA IC HI E L E C T R O N I C S ORDERING CODE IC 2 0 0 - 1 2 8 4 - 001 N - K INC hflE J> *m5S3b 0 0 G 0 S3 1 517 Protection Key K: N o Mark : W ith Protection Key Without Protection Key Positioning Pin N: Without Positioning Pin No Mark: With Positioning Pin


    OCR Scan     		PDF IC200, IC201, IC218) IC248-0444-001 IC201-0644-003 IC201-0644-019 IC218-0724-001 IC201-0804-020 IC201-0804-014 IC201-0804-005 IC51-1444-1354