DSA00373652.pdf by Advanced Micro Devices

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Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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0.3mm pitch BGA 0.3mm pitch csp package 0.4mm pitch BGA BGA Solder Ball 0.35mm bt resin Coffin-Manson Equation eh 11757 FBGA 63 FR4 substrate height and thickness JEDEC FBGA PCB design for very fine pitch csp package pi metal detector pitch 0.4mm BGA thermal cycling data weibull TSOP48 Thermal weibull test data