DSA00260168.pdf by STATS ChipPAC

Partial File Text FLGA-SD Fine Pitch Land Grid Array - Stacked Die · Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution · Available in 1.2mm (TFLGA), 1.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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AN 7823 techpoint Unbiased HAST 130, 85 RH, 100 Hrs

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