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    DASF007418.pdf

    • Altera
    • AN 353: Reflow Soldering Guidelines for Lead-Free Packages © February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-fre
    • Original
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    DASF007418.pdf preview Download Datasheet

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    GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE J-STD-020D JEDEC J-STD-020d.1 Lead Free reflow soldering profile BGA pcb warpage in ipc standard pcb warpage* in smt reflow Soldering guidelines

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