DSAUD0070615.pdf by Fujitsu

Partial File Text WIRELESS MODULE in a single multichip package (MCP) Utilizing "double side mount technology", Fujitsu is able to package 160 mixed technology components in a standard PQFP configuration. Major compo
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSAUD0070615.pdf preview Download Datasheet