DSAASSA00012337.pdf
-
Amkor Technology
-
data sheet
Features
wafer level packaging
WLCSP
Wafer Level Packaging (DSBGA / WLCSP / WSCSP / WLP) Amkor offers Wafer Level Chip Scale Packaging (WLCSP) to form solder bumps on device I/O pad
-
Original
-
-
Part pricing, stock, data attributes from Findchips.com