DSAASSA00012334.pdf by Amkor Technology

Partial File Text data sheet advanced product development tsCSP Features: Thin Substrate CSP (tsCSP): Very Thin, Superior Performance, Cost Effective Amkor's tsCSP is a land grid array multi-row package
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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Amkor TSCSP coreless substrate DS813 jedec package MO-247 MO-247

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