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    DSAASSA00012323.pdf

    • Amkor Technology
    • data sheet Features LAMINATE PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. · Custom ball counts up to 1521 · 1.00, 1.27 & 1.50 mm sta
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    • Part pricing, stock, data attributes from Findchips.com

    DSAASSA00012323.pdf preview Download Datasheet

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    4-Layer Ablestik 2300 Amkor Wafer level mold compound CCL-HL-832 CO-029 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY tepbga-2
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