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    DASF005678.pdf by Nichicon

    • DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, Low ESL,High ripple... current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 more
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    0E128 8J1234 F110E128MFK F110E227MDL F110E607MFK F110G107MDL F110G807MFK
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