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DSASW0042882.pdf
by InnovASIC Semiconductor
Partial File Text
Product Change Notice Product Change Notification Number: IA186XX-D Title: Additional Mold
...
ing Compound and Epoxy for Assembly flexibility Date of Notification: 9/22/2010 Samples Available: 10/22/1
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Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
DSASW0042882.pdf
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User Tagged Keywords
10-Added
1076WA
6600CS
Compound
Compound 6600cs
FRM-72-04-1
g631m
IA186ES
IA186ES-PQF100I-03
molding