DSASW0042882.pdf by InnovASIC Semiconductor

Partial File Text Product Change Notice Product Change Notification Number: IA186XX-D Title: Additional Molding Compound and Epoxy for Assembly flexibility Date of Notification: 9/22/2010 Samples Available: 10/22/1
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10-Added 1076WA 6600CS Compound Compound 6600cs FRM-72-04-1 g631m IA186ES IA186ES-PQF100I-03 molding

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