DSASW0042379.pdf by Amkor Technology

Partial File Text LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construc
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSASW0042379.pdf preview

Download Datasheet

User Tagged Keywords

amkor cabga thermal resistance amkor flip Amkor Wafer level mold compound CABGA 48 7x7 chiparray amkor cu pillar ds7409 ELC4785 FCCSP flip chip bga 0,8 mm Flip Chip Substrate HL832 HL832N