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DSA0085584.pdf
Manufacturer
Intel
Partial File Text
Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the m
Datasheet Type
Original
ECAD Model
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28F001BX
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INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
land pattern for TSOP 2-86
outline of the heat sink for Theta JC
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