DSA00332069.pdf by Microsemi

Partial File Text GaAs Schottky Devices Low CT Flip Chip ® TM MS8151 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features Capacitance (45 fF Typ.) Lo
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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MS8150-P2613 MS8151 P2613