We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

DSA00157486.pdf by Central Semiconductor

Partial File Text PROCESS CPQ090 4.0 Amp, 600 Volt TRIAC Chip TRIAC PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEO
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00157486.pdf by Central Semiconductor

DSA00157486.pdf preview Download Datasheet

DSA00157486.pdf preview

Download Datasheet