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DSA00362310.pdf
by International Rectifier
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PD - 97077 IRLC3103B HEXFET® Power MOSFET Die in Wafer Form l l D 100% Tested at Probe Available in Chip Pack, Unsawn wafer, Sawn on Film G S 30V RDS(on) = 0.019 (max.) 6" Wafer Ke
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