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    DSAUTAZ0016098.pdf

    • STMicroelectronics
    • ® Thermal Data SO 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy
    • Original

    DSAUTAZ0016098.pdf preview Download Datasheet

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