DSAUTAZ0016085.pdf by STMicroelectronics

Partial File Text ® Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 3.9 W/cm°C 0.2 W/cm°C leadframe die attach copper soft solder (
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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