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DSA00365579.pdf
Manufacturer
Motorola
Partial File Text
MOTOROLA Order this document EB211 by EB211/D SEMICONDUCTOR ENGINEERING BULLETIN EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW (Copper
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ECAD Model
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User Tagged Keywords
ansys
AP 494 Application Note
eb211
motorola milestone
MRF286