DSASL0051093.pdf by KOA Speer Electronics

Partial File Text NETWORKS THICK FILM R-NETWORKS STRUCTURE 1 Ceramic substrate 2 Pin connection 3 Printed conductor (Ag, Pd) 4 Resistive layer 5 Glass layer 6 Solder plated copper term. 7 Epoxy powder overc
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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