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DSASW00420057.pdf
by Xilinx
Partial File Text
665 Ball Flip-Chip BGA (FF665) Package PK220 (v1.1) August 5, 2009 X-Ref Target - Figure 1
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Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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User Tagged Keywords
EF665
FF665
FFG665
ms-034-aal-1
PK220
pk2200
Solder Balls
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