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    DSASW00416671.pdf by White Electronic Designs

    • W764M32V-XSBX Application Note W764M32V-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture
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    EIA/JESD22 W764M32V-XSBX
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