DSASW00416671.pdf by White Electronic Designs

Partial File Text W764M32V-XSBX Application Note W764M32V-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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EIA/JESD22 W764M32V-XSBX