DSA2IH0044345.pdf by Not Available

Partial File Text DENSE-PAC MICROSYSTEMS D E S C R IP TIO N : The D P Z 512X 16ln3 "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers (SL
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RoHS Unknown
Pb Free Unknown
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