The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA2IH0044337.pdf
Manufacturer
Not Available
Partial File Text
DENSE-PAC ,A s .v MICROSYSTEMS J D E S C R IP T IO N : The D P Z 256X 16ln3 "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
Datasheet Type
Scan
ECAD Model
DSA2IH0044337.pdf preview
Download Datasheet