DSASL004365.pdf by Texas Instruments

Partial File Text TEXAS INSTRUMENTS Final Notification for the Manufacture of 48/56 Pin TSSOP Package (DGG) at the TI Sherman Assembly/Test Facility November 12, 1996 Abstract As previously notified in March by P
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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KMC-166 TEXAS INSTRUMENTS, Mold Compound

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