DSAZIHA100084787.pdf by Central Semiconductor
- PROCESS CPZ37R Transient Voltage Suppressor 12 Volt TVS Chip PROCESS DETAILS Die Size 6.7 x 6.7 MILS Die Thickness 3.54 MILS Anode Bonding Pad Area 4.3 x 4.3 MILS Top Side
- Original
- Unknown
- Unknown
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