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    • HMR-10503 GaAs Monolithic Microwave Integrated Circuit 1.0 - 5.0 GHz MMIC AMPLIFIER Bonding pad widths: 0.075 (.003) Chip thickness: 0.25 (.010) Dimensions in millimeters (inches) Bonding Pad I
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    HMR-10503
    Supplyframe Tracking Pixel