DSAAQ00120421.pdf by Panduit

Partial File Text Polyimide Component Labels SPECIFICATION SHEET ® specifications Thermal transfer polyimide adhesive label material shall be specially designed for circuit board manufacturing where there will
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAAQ00120421.pdf preview

Download Datasheet

User Tagged Keywords

Mil-Std-202F 215j Polyimide