DSA00269461.pdf by Hewlett-Packard

Partial File Text Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features · Thermocompression/ Thermosonically Bondable · Ideal for Hybrid Integrated Circuits · G
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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