DSA2IH00176658.pdf

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Partial File Text SIEMENS IG B T P o w e r M od ule · P ow er m odule · 3-p h a se fu ll-bridge · In cluding fa st free -w h e e l diodes · P ackage w ith insulated m etal base plate BSM 30 GD 60 DN2 T yp e BSM
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