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    DSA00468434.pdf

    • Philips Semiconductors
    • INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Specification "bumped sawn wafer on UV-tape" Product Specification Revision 3.0 PUBLIC Philip
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    • Part pricing, stock, data attributes from Findchips.com

    DSA00468434.pdf preview Download Datasheet

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    HP4258 ibis format IBIS wafer map format ic u11 MIFARE Card IC Coil Design Guide uv-tape
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