DSA00468434.pdf by Philips Semiconductors

Partial File Text INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Specification "bumped sawn wafer on UV-tape" Product Specification Revision 3.0 PUBLIC Philip
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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HP4258 ibis format IBIS wafer map format ic u11 MIFARE Card IC Coil Design Guide uv-tape

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